MC9S12XDP512CAG Freescale Semiconductor, MC9S12XDP512CAG Datasheet - Page 107

• Manufacturer Part Number: MC9S12XDP512CAG
• Description: IC MCU 512K FLASH 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XDP512CAG

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 119
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 24x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Processor Series: S12XD
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 32 KB
• Interface Type: CAN/I2C/SCI/SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 119
• Number Of Timers: 12
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12XDP512E
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (24-ch x 10-bit)
• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 40MHz
• Total Internal Ram Size: 32KB
• # I/os (max): 119
• Number Of Timers - General Purpose: 12
• Operating Supply Voltage (typ): 2.5/5V
• Operating Supply Voltage (max): 2.75/5.5V
• Operating Supply Voltage (min): 2.35/3.15V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• For Use With: DEMO9S12XDT512E - BOARD DEMO FOR MC9S12XDT512EVB9S12XDP512E - BOARD DEMO FOR MC9S12XDP512
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Freescale Semiconductor
CME
0
1
1
1
SCME
X
0
1
1
SCMIE
X
X
0
1
Clock failure -->
Clock failure -->
Clock failure -->
Clock failure -->
SCMIF generates self clock mode wakeup interrupt.
Table 2-12. Outcome of Clock Loss in Wait Mode
Scenario 1: OSCCLK recovers prior to exiting wait mode.
Scenario 2: OSCCLK does not recover prior to exiting wait mode.
No action, clock loss not detected.
CRG performs Clock Monitor Reset immediately
Some time later OSCCLK recovers.
Some time later either a wakeup interrupt occurs (no SCM interrupt)
or an External Reset is applied.
Some time later either a wakeup interrupt occurs (no SCM interrupt)
or an External RESET is applied.
– MCU remains in wait mode,
– VREG enabled,
– PLL enabled,
– SCM activated,
– Start clock quality check,
– Set SCMIF interrupt flag.
– CM no longer indicates a failure,
– 4096 OSCCLK cycles later clock quality check indicates clock o.k.,
– SCM deactivated,
– PLL disabled depending on PLLWAI,
– VREG remains enabled (never gets disabled in wait mode).
– MCU remains in wait mode.
– Exit wait mode using OSCCLK as system clock (SYSCLK),
– Continue normal operation.
– Exit wait mode using OSCCLK as system clock,
– Start reset sequence.
– MCU remains in wait mode,
– VREG enabled,
– PLL enabled,
– SCM activated,
– Start clock quality check,
– Set SCMIF interrupt flag,
– Keep performing clock quality checks (could continue infinitely) while in wait mode.
– Exit wait mode in SCM using PLL clock (f
– Continue to perform additional clock quality checks until OSCCLK is o.k. again.
– Exit wait mode in SCM using PLL clock (f
– Start reset sequence,
– Continue to perform additional clock quality checks until OSCCLKis o.k.again.
– VREG enabled,
– PLL enabled,
– SCM activated,
– Start clock quality check,
– SCMIF set.
– Exit wait mode in SCM using PLL clock (f
– Continue to perform a additional clock quality checks until OSCCLK is o.k. again.
MC9S12XDP512 Data Sheet, Rev. 2.21
CRG Actions
Chapter 2 Clocks and Reset Generator (S12CRGV6)
SCM
SCM
SCM
) as system clock,
) as system clock,
) as system clock,
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