MC9S12XDP512CAG Freescale Semiconductor, MC9S12XDP512CAG Datasheet - Page 1306

• Manufacturer Part Number: MC9S12XDP512CAG
• Description: IC MCU 512K FLASH 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XDP512CAG

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 119
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 24x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Processor Series: S12XD
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 32 KB
• Interface Type: CAN/I2C/SCI/SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 119
• Number Of Timers: 12
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12XDP512E
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (24-ch x 10-bit)
• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 40MHz
• Total Internal Ram Size: 32KB
• # I/os (max): 119
• Number Of Timers - General Purpose: 12
• Operating Supply Voltage (typ): 2.5/5V
• Operating Supply Voltage (max): 2.75/5.5V
• Operating Supply Voltage (min): 2.35/3.15V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• For Use With: DEMO9S12XDT512E - BOARD DEMO FOR MC9S12XDT512EVB9S12XDP512E - BOARD DEMO FOR MC9S12XDP512
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Appendix F Ordering Information
Appendix F
Ordering Information
The following figure provides an ordering number example for the devices covered by this data book.
There are two options when ordering a device. Customers must choose between ordering either the
mask-specific partnumber or the generic / mask-independent partnumber Ordering the mask-specific
partnumber enables the customer to specify which particular maskset they will receive whereas FSL will
ship the currently preferred maskset against any orders for the generic partnumber. In either case, the
marking on the device will always show the generic / mask-independent partnumber and the mask set
number. For specific partnumbers, please contact your local sales office. The below figure illustrates a
mask-specific ordering number.
1308
Status / Partnumber type
S or SC = Maskset specific partnumber
MC = Generic/mask independent partnumber
P or PC = Prototype status
S 9 12XDP512 J1 M AL R
Part numbers may be abbreviated: check with manufacturer for exact part
number
Main Memory Type
9=Flash
3=ROM
Part name
(abbreviated)
see Table 1-6
MC9S12XDP512 Data Sheet, Rev. 2.21
Maskset identifier suffix (two digits):
First digit references wafer fab
Second digit differentiates mask
This suffix is omitted in generic partnumbers
J1 = 1L15Y maskset in this case
F0 = 0M42E maskset in this case
Temperature Option
C = -40 to 85 C
V = -40 to 105 C
M = -40 to 125 C
Tape & Reel Suffix (Optional):
No R = No Tape & Reel
R = Tape & Reel
Package Option
FU = 80QFP (non lead -free)
PV = 112LQFP (non lead -free)
FV = 144LQFP (non lead -free)
AA = 80QFP (lead free)
AL=112LQFP (lead free)
AG = 144LQFP (Lead free)
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