MC9S12XDP512CAG Freescale Semiconductor, MC9S12XDP512CAG Datasheet - Page 570

• Manufacturer Part Number: MC9S12XDP512CAG
• Description: IC MCU 512K FLASH 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XDP512CAG

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 119
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 24x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Processor Series: S12XD
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 32 KB
• Interface Type: CAN/I2C/SCI/SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 119
• Number Of Timers: 12
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12XDP512E
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (24-ch x 10-bit)
• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 40MHz
• Total Internal Ram Size: 32KB
• # I/os (max): 119
• Number Of Timers - General Purpose: 12
• Operating Supply Voltage (typ): 2.5/5V
• Operating Supply Voltage (max): 2.75/5.5V
• Operating Supply Voltage (min): 2.35/3.15V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• For Use With: DEMO9S12XDT512E - BOARD DEMO FOR MC9S12XDT512EVB9S12XDP512E - BOARD DEMO FOR MC9S12XDP512
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Chapter 15 Background Debug Module (S12XBDMV2)
15.1.2
BDM is available in all operating modes but must be enabled before firmware commands are executed.
Some systems may have a control bit that allows suspending the function during background debug mode.
15.1.2.1
All of these operations refer to the part in run mode and not being secured. The BDM does not provide
controls to conserve power during run mode.
15.1.2.2
If the device is in secure mode, the operation of the BDM is reduced to a small subset of its regular run
mode operation. Secure operation prevents access to Flash or EEPROM other than allowing erasure. For
more information please see
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Software control of BDM operation during wait mode
Software selectable clocks
Global page access functionality
Enabled but not active out of reset in emulation modes
CLKSW bit set out of reset in emulation mode.
When secured, hardware commands are allowed to access the register space in special single chip
mode, if the Flash and EEPROM erase tests fail.
Family ID readable from firmware ROM at global address 0x7FFF0F (value for HCS12X devices
is 0xC1)
BDM hardware commands are operational until system stop mode is entered (all bus masters are
in stop mode)
Normal modes
General operation of the BDM is available and operates the same in all normal modes.
Special single chip mode
In special single chip mode, background operation is enabled and active out of reset. This allows
programming a system with blank memory.
Emulation modes
In emulation mode, background operation is enabled but not active out of reset. This allows
debugging and programming a system in this mode more easily.
Modes of Operation
Regular Run Modes
Secure Mode Operation
Section 15.4.1,
MC9S12XDP512 Data Sheet, Rev. 2.21
“Security”.
Freescale Semiconductor