MC9S12XDP512CAG Freescale Semiconductor, MC9S12XDP512CAG Datasheet - Page 703

• Manufacturer Part Number: MC9S12XDP512CAG
• Description: IC MCU 512K FLASH 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XDP512CAG

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 119
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 24x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Processor Series: S12XD
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 32 KB
• Interface Type: CAN/I2C/SCI/SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 119
• Number Of Timers: 12
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12XDP512E
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (24-ch x 10-bit)
• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 40MHz
• Total Internal Ram Size: 32KB
• # I/os (max): 119
• Number Of Timers - General Purpose: 12
• Operating Supply Voltage (typ): 2.5/5V
• Operating Supply Voltage (max): 2.75/5.5V
• Operating Supply Voltage (min): 2.35/3.15V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• For Use With: DEMO9S12XDT512E - BOARD DEMO FOR MC9S12XDT512EVB9S12XDP512E - BOARD DEMO FOR MC9S12XDP512
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

19.3.1.7
Each of the state sequencer states 1 to 3 features a dedicated control register to determine if transitions
from that state are allowed depending upon comparator matches or tag hits and to define the next state for
the state sequencer following a match. The 3 debug state control registers are located at the same address
in the register address map (0x0027). Each register can be accessed using the COMRV bits in DBGC1 to
blend in the required register (see
19.3.1.8
Read: Anytime
Write: Anytime when DBG not armed.
This register is visible at 0x0027 only with COMRV[1:0] = 00. The state control register 1 selects the
targeted next state while in State1. The matches refer to the match channels of the comparator match
control logic as depicted in
Register
associated DBGXCTL control register.
Freescale Semiconductor
0x0027
SC[3:0}
Reset
Field
3–0
W
R
(DBGXCTL)”. Comparators must be enabled by setting the comparator enable bit in the
State Control Bits — These bits select the targeted next state while in State1, based upon the match event.
See
The trigger priorities described in
the lower channel number ([0,1,2,3) has priority. The SC[3:0] encoding ensures that a match leading to final
state has priority over all other matches.
Debug State Control Registers
Debug State Control Register 1 (DBGSCR1)
0
0
7
Table
Unimplemented or Reserved
19-21.
Figure 19-10. Debug State Control Register 1 (DBGSCR1)
0
0
6
Table 19-19. State Control Register Access Encoding
Figure 19-1
COMRV
Table 19-20. DBGSCR1 Field Descriptions
00
01
10
11
Table
MC9S12XDP512 Data Sheet, Rev. 2.21
0
0
5
and described in
19-19).
Table 19-38
Visible State Control Register
0
0
4
dictate that in the case of simultaneous matches, the match on
Description
Section 19.3.1.11.1, “Debug Comparator Control
DBGSCR1
DBGSCR2
DBGSCR3
DBGSCR3
SC3
0
3
Chapter 19 S12X Debug (S12XDBGV2) Module
SC2
0
2
SC1
0
1
SC0
0
0
705