MC9S12XDP512CAG Freescale Semiconductor, MC9S12XDP512CAG Datasheet - Page 1289

• Manufacturer Part Number: MC9S12XDP512CAG
• Description: IC MCU 512K FLASH 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XDP512CAG

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 119
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 24x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Processor Series: S12XD
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 32 KB
• Interface Type: CAN/I2C/SCI/SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 119
• Number Of Timers: 12
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12XDP512E
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (24-ch x 10-bit)
• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 40MHz
• Total Internal Ram Size: 32KB
• # I/os (max): 119
• Number Of Timers - General Purpose: 12
• Operating Supply Voltage (typ): 2.5/5V
• Operating Supply Voltage (max): 2.75/5.5V
• Operating Supply Voltage (min): 2.35/3.15V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• For Use With: DEMO9S12XDT512E - BOARD DEMO FOR MC9S12XDT512EVB9S12XDP512E - BOARD DEMO FOR MC9S12XDP512
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

B.1
Freescale Semiconductor
PIN 1
IDENT
L
C
J
36
144-Pin LQFP
1
4X
SECTION J1-J1
0.08
144
37
(ROTATED 90 )
0.20 T L-M
M
144 PL
S1
D
F
Figure B-1. 144-Pin LQFP Mechanical Dimensions (Case No. 918-03)
A1
T L-M
N
N
A
S
PLATING
BASE
METAL
AA
N
VIEW Y
MC9S12XDP512 Data Sheet, Rev. 2.21
2
4X 36 TIPS
2
C2
C1
109
72
0.05
VIEW AB
108
73
T
0.20 T L-M
(Y)
M
VIEW AB
0.1
B1 V1
SEATING
PLANE
T
(Z)
144X
N
(K)
E
B
R2
V
R1
C L
GAGE PLANE
0.25
1
NOTES:
1.
2.
3.
4.
5.
6.
DIMENSIONS AND TOLERANCING PER ASME
Y14.5M, 1994.
DIMENSIONS IN MILLIMETERS.
DATUMS L, M, N TO BE DETERMINED AT THE
SEATING PLANE, DATUM T.
DIMENSIONS S AND V TO BE DETERMINED
AT SEATING PLANE, DATUM T.
DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.25 PER SIDE. DIMENSIONS
A AND B DO INCLUDE MOLD MISMATCH
AND ARE DETERMINED AT DATUM PLANE H.
DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL NOT CAUSE THE D
DIMENSION TO EXCEED 0.35.
DIM
AA
A1
C1
C2
R1
R2
V1
B1
S1
A
B
C
D
E
G
K
V
Y
Z
F
J
P
S
VIEW Y
1
2
MILLIMETERS
Appendix B Package Information
MIN
1.40
0.05
1.35
0.17
0.45
0.17
0.09
0.13
0.13
0.09
20.00 BSC
10.00 BSC
20.00 BSC
10.00 BSC
22.00 BSC
11.00 BSC
22.00 BSC
11.00 BSC
11
0.50 BSC
0.25 REF
1.00 REF
0.50 REF
0.25 BSC
0
0
J1
J1
MAX
1.60
0.15
1.45
0.27
0.75
0.23
0.20
0.20
0.20
0.16
13
140X
7
4X
G
X
P
1291