MC9S12XDP512CAG Freescale Semiconductor, MC9S12XDP512CAG Datasheet - Page 805

• Manufacturer Part Number: MC9S12XDP512CAG
• Description: IC MCU 512K FLASH 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XDP512CAG

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 119
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 24x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Processor Series: S12XD
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 32 KB
• Interface Type: CAN/I2C/SCI/SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 119
• Number Of Timers: 12
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12XDP512E
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (24-ch x 10-bit)
• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 40MHz
• Total Internal Ram Size: 32KB
• # I/os (max): 119
• Number Of Timers - General Purpose: 12
• Operating Supply Voltage (typ): 2.5/5V
• Operating Supply Voltage (max): 2.75/5.5V
• Operating Supply Voltage (min): 2.35/3.15V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• For Use With: DEMO9S12XDT512E - BOARD DEMO FOR MC9S12XDT512EVB9S12XDP512E - BOARD DEMO FOR MC9S12XDP512
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Chapter 22
DP512 Port Integration Module (S12XDP512PIMV2)
22.1
The S12XD family port integration module (below referred to as PIM) establishes the interface between
the peripheral modules including the non-multiplexed external bus interface module (S12X_EBI) and the
I/O pins for all ports. It controls the electrical pin properties as well as the signal prioritization and
multiplexing on shared pins.
This document covers the description of:
Most I/O pins can be configured by register bits to select data direction and drive strength, to enable and
select pull-up or pull-down devices. Interrupts can be enabled on specific pins resulting in status flags.
The I/O’s of 2 MSCAN and all 3 SPI modules can be routed from their default location to alternative port
pins.
Freescale Semiconductor
•
•
•
•
•
•
•
•
•
•
•
Port A, B used as address output of the S12X_EBI
Port C, D used as data I/O of the S12X_EBI
Port E associated with the S12X_EBI control signals and the IRQ, XIRQ interrupt inputs
Port K associated with address output and control signals of the S12X_EBI
Port T connected to the Enhanced Capture Timer (ECT) module
Port S associated with 2 SCI and 1 SPI modules
Port M associated with 4 MSCAN modules and 1 SCI module
Port P connected to the PWM and 2 SPI modules — inputs can be used as an external interrupt
source
Port H associated with 2 SCI modules — inputs can be used as an external interrupt source
Port J associated with 1 MSCAN, 1 SCI, and 2 IIC modules — inputs can be used as an external
interrupt source
Port AD0 and AD1 associated with one 8-channel and one 16-channel ATD module
Introduction
The implementation of the PIM is device dependent. Therefore some
functions are not available on certain derivatives or 112-pin and 80-pin
package options.
MC9S12XDP512 Data Sheet, Rev. 2.21
NOTE
807