MC9S12XDP512CAG Freescale Semiconductor, MC9S12XDP512CAG Datasheet - Page 785

• Manufacturer Part Number: MC9S12XDP512CAG
• Description: IC MCU 512K FLASH 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XDP512CAG

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 119
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 24x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Processor Series: S12XD
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 32 KB
• Interface Type: CAN/I2C/SCI/SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 119
• Number Of Timers: 12
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12XDP512E
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (24-ch x 10-bit)
• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 40MHz
• Total Internal Ram Size: 32KB
• # I/os (max): 119
• Number Of Timers - General Purpose: 12
• Operating Supply Voltage (typ): 2.5/5V
• Operating Supply Voltage (max): 2.75/5.5V
• Operating Supply Voltage (min): 2.35/3.15V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• For Use With: DEMO9S12XDT512E - BOARD DEMO FOR MC9S12XDT512EVB9S12XDP512E - BOARD DEMO FOR MC9S12XDP512
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Chapter 21
External Bus Interface (S12XEBIV2)
21.1
This document describes the functionality of the XEBI block controlling the external bus interface.
The XEBI controls the functionality of a non-multiplexed external bus (a.k.a. ‘expansion bus’) in
relationship with the chip operation modes. Dependent on the mode, the external bus can be used for data
exchange with external memory, peripherals or PRU, and provide visibility to the internal bus externally
in combination with an emulator.
21.1.1
The XEBI includes the following features:
21.1.2
Refer to the S12X_MMC section for a detailed description of the MCU operating modes.
Freescale Semiconductor
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Output of up to 23-bit address bus and control signals to be used with a non-muxed external bus
Bidirectional 16-bit external data bus with option to disable upper half
Visibility of internal bus activity
Single-chip modes
The external bus interface is not available in these modes.
Expanded modes
Address, data, and control signals are activated on the external bus in normal expanded mode and
special test mode.
Emulation modes
The external bus is activated to interface to an external tool for emulation of normal expanded mode
or normal single-chip mode applications.
Introduction
Features
Modes of Operation
MC9S12XDP512 Data Sheet, Rev. 2.21
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