HD6417705F133BV Renesas Electronics America, HD6417705F133BV Datasheet - Page 114
HD6417705F133BV
Manufacturer Part Number
HD6417705F133BV
Description
MPU 3V 0K PB-FREE 208 FP
Manufacturer
Renesas Electronics America
Series
SuperH® SH7700r
Datasheet
1.HD6417705F133BV.pdf
(741 pages)
Specifications of HD6417705F133BV
Core Processor
SH-3
Core Size
32-Bit
Speed
133MHz
Connectivity
EBI/EMI, FIFO, IrDA, SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
105
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
208-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
- Current page: 114 of 741
- Download datasheet (5Mb)
result in poor efficiency. For this reason, a buffer for address translation (translation look-aside
buffer: TLB) is provided in hardware to hold frequently used address translation information. The
TLB can be described as a cache for storing address translation information. Unlike cache
memory, however, if address translation fails, that is, if an exception is generated, switching of
address translation information is normally performed by software. This makes it possible for
memory management to be performed flexibly by software.
The MMU has two methods of mapping from virtual memory to physical memory: a paging
method using fixed-length address translation, and a segment method using variable-length
address translation. With the paging method, the unit of translation is a fixed-size address space
(usually of 1 to 64 kbytes) called a page.
In the following text, the address space in virtual memory is referred to as virtual address space,
and address space in physical memory as physical memory space.
Rev. 2.00, 09/03, page 66 of 690
Process 1
Physical
memory
Process 1
Process 1
Process 2
Process 3
Figure 3.1 MMU Functions
Physical
memory
Physical
memory
(3)
(1)
Process 1
Process 2
Process 3
Process 1
memory
memory
Virtual
Virtual
MMU
MMU
Physical
memory
Physical
memory
(4)
(2)
Related parts for HD6417705F133BV
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
KIT STARTER FOR M16C/29
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER FOR R8C/2D
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
R0K33062P STARTER KIT
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER FOR R8C/23 E8A
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER FOR R8C/25
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER H8S2456 SHARPE DSPLY
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER FOR R8C38C
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER FOR R8C35C
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER FOR R8CL3AC+LCD APPS
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER FOR RX610
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER FOR R32C/118
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT DEV RSK-R8C/26-29
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER FOR SH7124
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT STARTER FOR H8SX/1622
Manufacturer:
Renesas Electronics America
Datasheet:
Part Number:
Description:
KIT DEV FOR SH7203
Manufacturer:
Renesas Electronics America
Datasheet: