HD6417750RF200DV Renesas Electronics America, HD6417750RF200DV Datasheet - Page 846

MPU 1.5/3.3V 0K I-TEMP PB-FREE 2

HD6417750RF200DV

Manufacturer Part Number
HD6417750RF200DV
Description
MPU 1.5/3.3V 0K I-TEMP PB-FREE 2
Manufacturer
Renesas Electronics America
Series
SuperH® SH7750r
Datasheet

Specifications of HD6417750RF200DV

Core Processor
SH-4
Core Size
32-Bit
Speed
200MHz
Connectivity
EBI/EMI, FIFO, SCI, SmartCard
Peripherals
DMA, POR, WDT
Number Of I /o
28
Program Memory Type
ROMless
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
1.35 V ~ 1.6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
208-QFP Exposed Pad, 208-eQFP, 208-HQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6417750RF200DV
Manufacturer:
FREESCALE
Quantity:
450
Section 16 Serial Communication Interface with FIFO (SCIF)
Data Transfer Operations
SCIF Initialization: Before transmitting and receiving data, it is necessary to clear the TE and RE
bits in SCSCR2 to 0, then initialize the SCIF as described below.
When the transfer format, etc., is changed, the TE and RE bits must be cleared to 0 before making
the change using the following procedure. When the TE bit is cleared to 0, SCTSR2 is initialized.
Note that clearing the TE and RE bits to 0 does not change the contents of SCFSR2, SCFTDR2, or
SCFRDR2. The TE bit should be cleared to 0 after all transmit data has been sent and the TEND
flag in SCFSR2 has been set. TEND can also be cleared to 0 during transmission, but the data
being transmitted will go to the mark state after the clearance. Before setting TE again to start
transmission, the TFRST bit in SCFCR2 should first be set to 1 to reset SCFTDR2.
When an external clock is used the clock should not be stopped during operation, including
initialization, since operation will be unreliable in this case.
Rev.7.00 Oct. 10, 2008 Page 760 of 1074
REJ09B0366-0700

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