LPC1768FET100,551 NXP Semiconductors, LPC1768FET100,551 Datasheet - Page 4

IC MCU 32BIT 512KB FLASH 100LQFP

LPC1768FET100,551

Manufacturer Part Number
LPC1768FET100,551
Description
IC MCU 32BIT 512KB FLASH 100LQFP
Manufacturer
NXP Semiconductors
Series
LPC17xxr
Datasheet

Specifications of LPC1768FET100,551

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
100MHz
Connectivity
CAN, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
2.4 V ~ 3.6 V
Data Converters
A/D 8x12b, D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LQFP
Processor Series
LPC1768
Core
ARM Cortex-M3
Data Bus Width
32 bit
Data Ram Size
16 KB
Interface Type
Ethernet, USB, CAN, I2S, I2C
Maximum Clock Frequency
100 MHz
Number Of Programmable I/os
70
Number Of Timers
4
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Other names
568-5215

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC1768FET100,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
3. Applications
4. Ordering information
Table 1.
Table 2.
LPC1769_68_67_66_65_64_63
Product data sheet
Type number
LPC1769FBD100
LPC1768FBD100
LPC1768FET100
LPC1767FBD100
LPC1766FBD100
LPC1765FBD100
LPC1764FBD100
LPC1763FBD100
Type number
LPC1769FBD100 512 kB 32
LPC1768FBD100 512 kB 32
LPC1768FET100 512 kB 32
LPC1767FBD100 512 kB 32
LPC1766FBD100 256 kB 32
LPC1765FBD100 256 kB 32
LPC1764FBD100 128 kB 16
LPC1763FBD100 256 kB 32
Ordering information
Ordering options
4.1 Ordering options
Flash
Package
Name
LQFP100
LQFP100
TFBGA100
LQFP100
LQFP100
LQFP100
LQFP100
LQFP100
SRAM in kB
CPU AHB
eMetering
Lighting
Industrial networking
SRAM0
16
16
16
16
16
16
16
16
plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm SOT926-1
Description
plastic low profile quad flat package; 100 leads; body 14 × 14 × 1.4 mm
plastic low profile quad flat package; 100 leads; body 14 × 14 × 1.4 mm
plastic low profile quad flat package; 100 leads; body 14 × 14 × 1.4 mm
plastic low profile quad flat package; 100 leads; body 14 × 14 × 1.4 mm
plastic low profile quad flat package; 100 leads; body 14 × 14 × 1.4 mm
plastic low profile quad flat package; 100 leads; body 14 × 14 × 1.4 mm
plastic low profile quad flat package; 100 leads; body 14 × 14 × 1.4 mm
All information provided in this document is subject to legal disclaimers.
AHB
SRAM1
16
16
16
16
16
16
-
16
Rev. 7 — 5 April 2011
Total
64
64
64
64
64
64
32
64
LPC1769/68/67/66/65/64/63
Ethernet USB
yes
yes
yes
yes
yes
no
yes
no
Device/Host/OTG 2
Device/Host/OTG 2
Device/Host/OTG 2
no
Device/Host/OTG 2
Device/Host/OTG 2
Device only
no
Alarm systems
White goods
Motor control
32-bit ARM Cortex-M3 microcontroller
CAN I
no
2
no
yes yes
yes yes
yes yes
yes yes
yes yes
yes yes
no
yes yes
2
S
© NXP B.V. 2011. All rights reserved.
DAC Maximum
no
120 MHz
100 MHz
100 MHz
100 MHz
100 MHz
CPU
operating
frequency
100 MHz
100 MHz
100 MHz
Version
SOT407-1
SOT407-1
SOT407-1
SOT407-1
SOT407-1
SOT407-1
SOT407-1
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