ADSP-21062LABZ-160 Analog Devices Inc, ADSP-21062LABZ-160 Datasheet - Page 37

IC,DSP,32-BIT,CMOS,BGA,225PIN,PLASTIC

ADSP-21062LABZ-160

Manufacturer Part Number
ADSP-21062LABZ-160
Description
IC,DSP,32-BIT,CMOS,BGA,225PIN,PLASTIC
Manufacturer
Analog Devices Inc
Series
SHARC®r
Type
Floating Pointr

Specifications of ADSP-21062LABZ-160

Interface
Host Interface, Link Port, Serial Port
Clock Rate
40MHz
Non-volatile Memory
External
On-chip Ram
256kB
Voltage - I/o
3.30V
Voltage - Core
3.30V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
225-BGA
Package
225BGA
Numeric And Arithmetic Format
Floating-Point
Maximum Speed
40 MHz
Ram Size
256 KB
Device Million Instructions Per Second
40 MIPS
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ADSP-21062LABZ-160
Manufacturer:
SAMSUNG
Quantity:
591
Part Number:
ADSP-21062LABZ-160
Manufacturer:
Analog Devices Inc
Quantity:
10 000
ADSP-21060/ADSP-21060L/ADSP-21062/ADSP-21062L/ADSP-21060C/ADSP-21060LC
MSx, SW
DMARx
DMAGx
ADDR
CLKIN
DATA
(OUT)
DATA
(IN)
WR
RD
EXTERNAL MEMORY* (EXTERNAL HANDSHAKE MODE)
INTERNAL MEMORY AND EXTERNAL DEVICE
TRANSFERS BETWEEN EXTERNAL DEVICE AND
*MEMORY READ BUS MASTER, MEMORY WRITE BUS MASTER, OR SYNCHRONOUS READ/WRITE BUS MASTER
(EXTERNAL DEVICE TO EXTERNAL MEMORY)
(EXTERNAL MEMORY TO EXTERNAL DEVICE)
(FROM ADSP-2106x TO EXTERNAL DEVICE)
TRANSFERS BETWEEN ADSP-2106x
(FROM EXTERNAL DEVICE TO ADSP-2106x)
TIMING SPECIFICATIONS FOR ADDR31–0, RD, WR, SW MS3–0, AND ACK ALSO APPLY HERE.
t
SDRLC
t
WDR
t
DGWRL
Rev. F | Page 37 of 64 | March 2008
Figure 23. DMA Handshake
t
DDGL
t
DMARLL
t
DGRDL
t
DADGH
t
SDATDGL
t
DGWRH
t
DRDGH
t
t
DATDRH
SDRHC
t
WDGL
t
t
DMARH
HDGC
t
VDATDGH
t
t
DGWRR
HDATIDG
t
t
DATRDGH
DGRDR
t
WDGH
t
DDGHA

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