ADSP-21062LABZ-160 Analog Devices Inc, ADSP-21062LABZ-160 Datasheet - Page 60

• Manufacturer Part Number: ADSP-21062LABZ-160
• Description: IC,DSP,32-BIT,CMOS,BGA,225PIN,PLASTIC
• Manufacturer: Analog Devices Inc
• Series: SHARC®r
• Type: Floating Pointr

Specifications of ADSP-21062LABZ-160

• Interface: Host Interface, Link Port, Serial Port
• Clock Rate: 40MHz
• Non-volatile Memory: External
• On-chip Ram: 256kB
• Voltage - I/o: 3.30V
• Voltage - Core: 3.30V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 225-BGA
• Package: 225BGA
• Numeric And Arithmetic Format: Floating-Point
• Maximum Speed: 40 MHz
• Ram Size: 256 KB
• Device Million Instructions Per Second: 40 MIPS
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADSP-21060/ADSP-21060L/ADSP-21062/ADSP-21062L/ADSP-21060C/ADSP-21060LC
SURFACE-MOUNT DESIGN
Table 43
standard design recommendations, refer to IPC-7351, Generic
Requirements for Surface-Mount Design and Land Pattern
Standard.
Table 43. BGA Data for Use with Surface-Mount Design
Package
225-Ball Grid Array (PBGA)
2.05
65.90
BSC
0.50
is provided as an aide to PCB design. For industry-
3.42
3.17
2.92
121
180
120
181
SEAL RING
75.00 BSC SQ
75.50 BSC SQ
SIDE VIEW
TOP VIEW
29.50 BSC
Figure 45. 240-Lead Ceramic Quad Flat Package, Mounted with Cavity Up [CQFP]
LID
Ball Attach Type
Solder Mask Defined
61
240
60
1
INDEX 1
GOLD
PLATED
Rev. F | Page 60 of 64 | March 2008
Dimensions shown in millimeters
0.90
0.80
0.70
(QS-240-1B)
29.50
BSC
1.22 (4×)
2.60
2.55
2.50
3.60
3.55
3.50
Solder Mask Opening
0.63 mm diameter
NO GOLD
2.00 DIA
INDEX 2
NONCONDUCTIVE
CERAMIC TIE BAR
60
1
240
61
BOTTOM VIEW
70.00 BSC SQ
HEAT SLUG
Ball Pad Size
0.76 mm diameter
181
120
180
121
16.50 (8×)