ADSP-21062LABZ-160 Analog Devices Inc, ADSP-21062LABZ-160 Datasheet - Page 59

IC,DSP,32-BIT,CMOS,BGA,225PIN,PLASTIC

ADSP-21062LABZ-160

Manufacturer Part Number
ADSP-21062LABZ-160
Description
IC,DSP,32-BIT,CMOS,BGA,225PIN,PLASTIC
Manufacturer
Analog Devices Inc
Series
SHARC®r
Type
Floating Pointr

Specifications of ADSP-21062LABZ-160

Interface
Host Interface, Link Port, Serial Port
Clock Rate
40MHz
Non-volatile Memory
External
On-chip Ram
256kB
Voltage - I/o
3.30V
Voltage - Core
3.30V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
225-BGA
Package
225BGA
Numeric And Arithmetic Format
Floating-Point
Maximum Speed
40 MHz
Ram Size
256 KB
Device Million Instructions Per Second
40 MIPS
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ADSP-21062LABZ-160
Manufacturer:
SAMSUNG
Quantity:
591
Part Number:
ADSP-21062LABZ-160
Manufacturer:
Analog Devices Inc
Quantity:
10 000
ADSP-21060/ADSP-21060L/ADSP-21062/ADSP-21062L/ADSP-21060C/ADSP-21060LC
INDICATOR
-3°
4.20
3.52
2.85
PIN 1
60
1
240
61
0.90
0.75
0.60
NOTES:
1. LEAD FINISH = GOLD PLATE
2. LEAD SWEEP/LEAD OFFSET = 0.013mm MAX
(Sweep and/or Offset can be used as the controlling dimension).
SEAL RING
0.23
0.20
0.17
(PINS DOWN)
32.00 BSC SQ
Figure 44. 240-Lead Ceramic Quad Flat Package, Heat Slug Down [CQFP]
LID
TOP VIEW
36.60
36.13 SQ
35.65
28.05
27.80 SQ
27.55
0.50 BSC
Rev. F | Page 59 of 64 | March 2008
Dimensions shown in millimeters
0.50
0.30
0.10
181
120
(QS-240-1A)
180
121
VIEW A
0.175
0.156
0.137
3.70
3.22
2.75
180
121
120
181
0.15
VIEW A
BOTTOM VIEW
HEAT SLUG
2.06 REF
(PINS UP)
REF SQ
19.00
1.70
LEAD THICKNESS
0.15
0.180
0.155
0.130
0.35
0.30
0.25
240
61
1
60

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