ADSP-21062LABZ-160 Analog Devices Inc, ADSP-21062LABZ-160 Datasheet - Page 50

• Manufacturer Part Number: ADSP-21062LABZ-160
• Description: IC,DSP,32-BIT,CMOS,BGA,225PIN,PLASTIC
• Manufacturer: Analog Devices Inc
• Series: SHARC®r
• Type: Floating Pointr

Specifications of ADSP-21062LABZ-160

• Interface: Host Interface, Link Port, Serial Port
• Clock Rate: 40MHz
• Non-volatile Memory: External
• On-chip Ram: 256kB
• Voltage - I/o: 3.30V
• Voltage - Core: 3.30V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 225-BGA
• Package: 225BGA
• Numeric And Arithmetic Format: Floating-Point
• Maximum Speed: 40 MHz
• Ram Size: 256 KB
• Device Million Instructions Per Second: 40 MIPS
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADSP-21060/ADSP-21060L/ADSP-21062/ADSP-21062L/ADSP-21060C/ADSP-21060LC
ENVIRONMENTAL CONDITIONS
The ADSP-2106x processors are rated for performance under
T
ditions (5 V) on Page 15
Page
Thermal Characteristics for MQFP_PQ4 and PBGA
Packages
The ADSP-21060/ADSP-21060L and ADSP-21062/ADSP-
21062L are available in 240-lead thermally enhanced
MQFP_PQ4 and 225-ball plastic ball grid array packages. The
top surface of the thermally enhanced MQFP_PQ4 contains a
metal slug from which most of the die heat is dissipated. The
slug is flush with the top surface of the package. Note that the
metal slug is internally connected to GND through the device
substrate.
Both packages are specified for a case temperature (T
ensure that the T
flow source may be used. A heatsink should be attached with a
thermal adhesive.
T
PD =Power dissipation in W (this value depends upon the spe-
cific application; a method for calculating PD is shown under
Power Dissipation).
Table 37. Thermal Characteristics for Thermally Enhanced
240-Lead MQFP_PQ4
1
2
Table 38. Thermal Characteristics for BGA
1
Parameter
T
T
T
T
T
Parameter
T
T
T
This represents thermal resistance at total power of 5 W. With airflow, no
LFM = Linear feet per minute of airflow.
LFM = Linear feet per minute of airflow.
CASE
CASE
variance is seen in T
at 2 W, T
at 3 W, T
CA
CA
CA
CA
CA
CA
CA
CA
T
CA
T
T
CA
CASE
at 0 LFM varies with power:
18.
= Case temperature (measured on top surface of package)
environmental conditions specified in the
=Value from
= T
CA
CA
= 14°C/W
= 11°C/W
AMB
+ (PD u T
Airflow (LFM
100
200
400
600
Airflow (LFM
0
200
400
0
CASE
CA
at 5 W.
Table 37
is not exceeded, a heatsink and/or an air-
1
and
CA
)
Operating Conditions (3.3 V) on
below.
2
1
)
)
Typical
10
9
8
7
6
Typical
20.70
15.30
12.90
Operating Con-
Rev. F | Page 50 of 64 | March 2008
CASE
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
°C/W
°C/W
°C/W
). To
Thermal Characteristics for CQFP Package
The ADSP-21060C/ADSP-21060LC are available in 240-lead
thermally enhanced ceramic QFP (CQFP). There are two pack-
age versions, one with a copper/tungsten heat slug on top of the
package (CZ) for air cooling, and one with the heat slug on the
bottom (CW) for cooling through the board. The ADSP-2106x
is specified for a case temperature (T
T
an air flow source may be used. A heatsink should be attached
with a thermal adhesive.
T
PD = Power dissipation in W (this value depends upon the spe-
cific application; a method for calculating PD is shown under
Power Dissipation).
Table 39. Thermal Characteristics for Thermally Enhanced
240-Lead CQFP
1
2
Parameter
ADSP-21060CW/ADSP-21060LCW
T
T
T
T
T
ADSP-21060CZ/ADSP-21060LCZ
T
T
T
T
T
This represents thermal resistance at total power of 5 W. With airflow, no
LFM = Linear feet per minute of airflow.
CASE
CASE
variance is seen in T
T
ADSP-21060CW/ADSP-21060LCW:
at 2 W, T
at 3 W, T
ADSP-21060CZ/ADSP-21060LCZ:
at 2 W, T
at 3 W, T
T
CA
CA
CA
CA
CA
CA
CA
CA
CA
CA
CA
JC
T
T
= 0.24°C/W for all CQFP models.
at 0 LFM varies with power.
CASE
CA
= Case temperature (measured on top surface of package)
data sheet specification is not exceeded, a heatsink and/or
=Value from
= T
CA
CA
CA
CA
= 23°C/W
= 21.5°C/W
= 24°C/W
= 21.5°C/W
AMB
+ (PD u T
Airflow (LFM
0
100
200
400
600
0
100
200
400
600
1
CA
at 5W.
Table 38
CA
)
2
below.
)
CASE
). To ensure that the
Typical
19.5
16
14
12
10
20
16
14
11.5
9.5
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W