PIC32MX575F512LT-80I/BG Microchip Technology, PIC32MX575F512LT-80I/BG Datasheet - Page 43

• Manufacturer Part Number: PIC32MX575F512LT-80I/BG
• Description: 512KB Flash, 64KB RAM, 80 MHz, USB, 1xCAN, 8 DMA 121 XBGA 10x10x1.20mm T/R
• Manufacturer: Microchip Technology
• Series: PIC® 32MXr

Specifications of PIC32MX575F512LT-80I/BG

• Core Processor: MIPS32® M4K™
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CAN, I²C, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 2.3 V ~ 3.6 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 121-TFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Number Of I /o: -
• Eeprom Size: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

2.5
The PGECx and PGEDx pins are used for In-Circuit
Serial Programming™ (ICSP™) and debugging pur-
poses. It is recommended to keep the trace length
between the ICSP connector and the ICSP pins on the
device as short as possible. If the ICSP connector is
expected to experience an ESD event, a series resistor
is recommended, with the value in the range of a few
tens of Ohms, not to exceed 100 Ohms.
Pull-up resistors, series diodes and capacitors on the
PGECx and PGEDx pins are not recommended as they
will interfere with the programmer/debugger communi-
cations to the device. If such discrete components are
an application requirement, they should be removed
from the circuit during programming and debugging.
Alternatively, refer to the AC/DC characteristics and
timing requirements information in the respective
device Flash programming specification for information
on capacitive loading limits and pin input voltage high
(V
Ensure that the “Communication Channel Select” (i.e.,
PGECx/PGEDx pins) programmed into the device
matches the physical connections for the ICSP to
MPLAB
For more information on ICD 2, ICD 3 and REAL ICE
connection requirements, refer to the following
documents that are available on the Microchip web
site.
• “MPLAB
• “Using MPLAB
• “MPLAB
• “Using MPLAB
• “MPLAB
• “MPLAB
• “Using MPLAB
© 2010 Microchip Technology Inc.
IH
Guide” DS51331
User’s Guide” DS51616
DS51749
) and input low (V
®
ICSP Pins
ICD 2, MPLAB ICD 3 or MPLAB REAL ICE™.
®
®
®
®
ICD 2 In-Circuit Debugger User’s
ICD 2 Design Advisory” DS51566
ICD 3 Design Advisory” DS51764
REAL ICE™ In-Circuit Debugger
®
®
®
ICD 2” (poster) DS51265
ICD 3” (poster) DS51765
REAL ICE™ Emulator” (poster)
IL
) requirements.
PIC32MX5XX/6XX/7XX
2.6
The TMS, TDO, TDI and TCK pins are used for testing
and debugging according to the Joint Test Action
Group (JTAG) standard. It is recommended to keep the
trace length between the JTAG connector and the
JTAG pins on the device as short as possible. If the
JTAG connector is expected to experience an ESD
event, a series resistor is recommended, with the value
in the range of a few tens of Ohms, not to exceed 100
Ohms.
Pull-up resistors, series diodes and capacitors on the
TMS, TDO, TDI and TCK pins are not recommended
as they will interfere with the programmer/debugger
communications to the device. If such discrete compo-
nents are an application requirement, they should be
removed from the circuit during programming and
debugging. Alternatively, refer to the AC/DC character-
istics and timing requirements information in the
respective device Flash programming specification for
information on capacitive loading limits and pin input
voltage high (V
2.7
The trace pins can be connected to a hardware-trace-
enabled programmer to provide a compress real time
instruction trace. When used for trace the TRD3,
TRD2, TRD1, TRD0 and TRCLK pins should be
dedicated for this use. The trace hardware requires
a 22Ω series resistor between the trace pins and the
trace connector.
JTAG
Trace
IH
) and input low (V
IL
) requirements.
DS61156F-page 43