MPC8241LZQ200D Freescale Semiconductor, MPC8241LZQ200D Datasheet - Page 47

• Manufacturer Part Number: MPC8241LZQ200D
• Description: IC MPU 32BIT 200MHZ PPC 357-PBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC8241LZQ200D

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 200MHz
• Voltage: 1.8V
• Mounting Type: Surface Mount
• Package / Case: 357-PBGA
• Family Name: MPC82XX
• Device Core: PowerQUICC II
• Device Core Size: 32b
• Frequency (max): 200MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.8V
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 357
• Package Type: BGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Not Compliant

7.7
This section provides thermal management information for the plastic ball grid array (PBGA) package for
air-cooled applications. Depending on the application environment and the operating frequency, a heat
sink may be required to maintain junction temperature within specifications. Proper thermal control design
primarily depends on the system-level design: heat sink, airflow, and thermal interface material. To reduce
the die-junction temperature, heat sinks can be attached to the package by several methods: adhesive,
spring clip to holes in the printed-circuit board or package, or mounting clip and screw assembly (see
Figure
Figure 29
Freescale Semiconductor
•
•
•
•
28).
A heat sink is not attached to the PBGA package and a high board-level thermal loading from
adjacent components exists (label used—1s).
A heat sink is not attached to the PBGA package and a low board-level thermal loading from
adjacent components exists (label used—2s2p).
A large heat sink (cross cut extrusion, 38 × 38 × 16.5 mm) is attached to the PBGA package and a
high board-level thermal loading from adjacent components exists (label used—1s/sink).
A large heat sink (cross cut extrusion, 38 × 38 × 16.5 mm) is attached to the PBGA package and a
low board-level thermal loading from adjacent components exists (label used—2s2p/sink).
Thermal Management
depicts the die junction-to-ambient thermal resistance for four typical cases:
Figure 28. Package Exploded Cross-Sectional View with Several Heat Sink Options
Thermal Interface
MPC8241 Integrated Processor Hardware Specifications, Rev. 10
Adhesive or
Material
Heat Sink
Heat Sink
Die
Clip
Printed-Circuit Board
PBGA Package
Wire
Option
System Design Information
47