MPC8349ECVVAGDB Freescale Semiconductor, MPC8349ECVVAGDB Datasheet - Page 54

IC MPU POWERQUICC II 672-TBGA

MPC8349ECVVAGDB

Manufacturer Part Number
MPC8349ECVVAGDB
Description
IC MPU POWERQUICC II 672-TBGA
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MPC8349ECVVAGDB

Processor Type
MPC83xx PowerQUICC II Pro 32-Bit
Speed
400MHz
Voltage
1.2V
Mounting Type
Surface Mount
Package / Case
672-TBGA
For Use With
MPC8349E-MITX-GP - KIT REFERENCE PLATFORM MPC8349EMPC8349E-MITXE - BOARD REFERENCE FOR MPC8349MPC8349EA-MDS-PB - KIT MODULAR DEV SYSTEM MPC8349E
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC8349ECVVAGDB
Manufacturer:
FREESCALE
Quantity:
8
Part Number:
MPC8349ECVVAGDB
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Package and Pin Listings
18.1
The package parameters are provided in the following list. The package type is 35 mm × 35 mm, 672 tape
ball grid array (TBGA).
54
Package outline
Interconnects
Pitch
Module height (typical)
Solder balls
Ball diameter (typical)
Package Parameters for the MPC8349EA TBGA
MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
672
1.00 mm
1.46 mm
62 Sn/36 Pb/2 Ag (ZU package)
96.5 Sn/3.5Ag (VV package)
0.64 mm
35 mm × 35 mm
Freescale Semiconductor

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