MPC8349ECVVAGDB Freescale Semiconductor, MPC8349ECVVAGDB Datasheet - Page 77

• Manufacturer Part Number: MPC8349ECVVAGDB
• Description: IC MPU POWERQUICC II 672-TBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC8349ECVVAGDB

• Processor Type: MPC83xx PowerQUICC II Pro 32-Bit
• Speed: 400MHz
• Voltage: 1.2V
• Mounting Type: Surface Mount
• Package / Case: 672-TBGA
• For Use With: MPC8349E-MITX-GP - KIT REFERENCE PLATFORM MPC8349EMPC8349E-MITXE - BOARD REFERENCE FOR MPC8349MPC8349EA-MDS-PB - KIT MODULAR DEV SYSTEM MPC8349E
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -

where:
R
change the case-to-ambient thermal resistance, R
sink, the air flow around the device, the interface material, the mounting arrangement on printed-circuit
board, or change the thermal dissipation on the printed-circuit board surrounding the device.
The thermal performance of devices with heat sinks has been simulated with a few commercially available
heat sinks. The heat sink choice is determined by the application environment (temperature, air flow,
adjacent component power dissipation) and the physical space available. Because there is not a standard
application environment, a standard heat sink is not required.
Table 64
Accurate thermal design requires thermal modeling of the application environment using computational
fluid dynamics software which can model both the conduction cooling and the convection cooling of the
air moving through the application. Simplified thermal models of the packages can be assembled using the
junction-to-case and junction-to-board thermal resistances listed in the thermal resistance table. More
detailed thermal models can be made available on request.
Freescale Semiconductor
AAVID 30 × 30 × 9.4 mm pin fin
AAVID 30 × 30 × 9.4 mm pin fin
AAVID 30 × 30 × 9.4 mm pin fin
AAVID 31 × 35 × 23 mm pin fin
AAVID 31 × 35 × 23 mm pin fin
AAVID 31 × 35 × 23 mm pin fin
Wakefield, 53 × 53 × 25 mm pin fin
Wakefield, 53 × 53 × 25 mm pin fin
Wakefield, 53 × 53 × 25 mm pin fin
MEI, 75 × 85 × 12 no adjacent board, extrusion
MEI, 75 × 85 × 12 no adjacent board, extrusion
MEI, 75 × 85 × 12 no adjacent board, extrusion
MEI, 75 × 85 × 12 mm, adjacent board, 40 mm side bypass
θ
JC
is device-related and cannot be influenced by the user. The user controls the thermal environment to
R
R
R
θ
θ
θ
shows heat sink thermal resistance for TBGA of the MPC8349EA.
JA
JC
CA
MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Heat Sink Assuming Thermal Grease
= junction-to-ambient thermal resistance (°C/W)
= junction-to-case thermal resistance (°C/W)
= case-to-ambient thermal resistance (°C/W)
Table 64. Heat Sink and Thermal Resistance of MPC8349EA (TBGA)
θ
CA
. For instance, the user can change the size of the heat
Natural convection
Natural convection
Natural convection
Natural convection
Air Flow
1 m/s
2 m/s
1 m/s
2 m/s
1 m/s
2 m/s
1 m/s
2 m/s
1 m/s
Thermal Resistance
35 × 35 mm TBGA
6.5
5.6
8.4
4.7
5.7
3.5
2.7
6.7
4.1
2.8
3.1
10
4
Thermal
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