MPC8270VVUPEA Freescale Semiconductor, MPC8270VVUPEA Datasheet - Page 11

• Manufacturer Part Number: MPC8270VVUPEA
• Description: IC MPU POWERQUICC II 480-TBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC IIr

Specifications of MPC8270VVUPEA

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 450MHz
• Voltage: 1.5V
• Mounting Type: Surface Mount
• Package / Case: 480-TBGA
• Processor Series: MPC8xxx
• Core: 603e
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 450 MHz
• Operating Supply Voltage: 0 V to 3 V
• Maximum Operating Temperature: + 105 C
• Data Ram Size: 32 KB
• Program Memory Size: 16 KB
• Program Memory Type: EPROM/Flash
• Core Size: 32 Bit
• Cpu Speed: 450MHz
• Embedded Interface Type: I2C, JTAG, SPI, UART
• Digital Ic Case Style: TBGA
• No. Of Pins: 480
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

3
4
5
4 Thermal Characteristics
Table 6
package. For the discussions sections 4.1 and 4.5, P
the I/O drivers.
1
2
3
4
4.1 Estimation with Junction-to-Ambient Thermal Resistance
An estimation of the chip junction temperature, T
where:
The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy estimation
of thermal performance. However, the answer is only an estimate; test cases have demonstrated that errors of a factor
of two (in the quantity T
Freescale Semiconductor
Junction to ambient—
single-layer board
Junction to ambient—
four-layer board
Junction to board
Junction to case
Junction-to-package top
issue.
the top surface of the board near the package.
1012.1).
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
The leakage current is measured for nominal VDDH,VCCSYN, and VDD.
V
MPC8280, MPC8275VR, MPC8275ZQ only.
Assumes no thermal vias.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
IL
for IIC interface does not match IIC standard, but does meet IIC standard for V
Characteristic
describes thermal characteristics for both the packages. See
T
R
P
A
D
θJA
= ambient temperature (ºC)
= power dissipation in package
= package junction-to-ambient thermal resistance (ºC/W)
T
3
J
2
1
= T
A
4
+ (R
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
J
– T
θJA
A
) are possible.
Symbol
× P
R
R
R
R
Ψ
θJC
θJA
θJA
θJB
JT
D
)
Table 6. Thermal Characteristics
480 TBGA
16
12
11
J
6
2
2
9
, in °C can be obtained from the following equation:
D
= (V
Value
DD
× I
DD
516 PBGA
) + PI/O, where PI/O is the power dissipation of
Table 2
27
21
19
16
11
8
2
for information about a given device’s
OL
and should not cause any compatibility
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Thermal Characteristics
Natural convection
Natural convection
Air Flow
1 m/s
1 m/s
—
—
—
11