MPC8270VVUPEA Freescale Semiconductor, MPC8270VVUPEA Datasheet - Page 12

• Manufacturer Part Number: MPC8270VVUPEA
• Description: IC MPU POWERQUICC II 480-TBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC IIr

Specifications of MPC8270VVUPEA

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 450MHz
• Voltage: 1.5V
• Mounting Type: Surface Mount
• Package / Case: 480-TBGA
• Processor Series: MPC8xxx
• Core: 603e
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 450 MHz
• Operating Supply Voltage: 0 V to 3 V
• Maximum Operating Temperature: + 105 C
• Data Ram Size: 32 KB
• Program Memory Size: 16 KB
• Program Memory Type: EPROM/Flash
• Core Size: 32 Bit
• Cpu Speed: 450MHz
• Embedded Interface Type: I2C, JTAG, SPI, UART
• Digital Ic Case Style: TBGA
• No. Of Pins: 480
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Thermal Characteristics
4.2 Estimation with Junction-to-Case Thermal Resistance
Historically, the thermal resistance has frequently been expressed as the sum of a junction-to-case thermal resistance
and a case-to-ambient thermal resistance:
where:
R
case-to-ambient thermal resistance, R
heat sink, change the mounting arrangement on the printed circuit board, or change the thermal dissipation on the
printed circuit board surrounding the device. This thermal model is most useful for ceramic packages with heat sinks
where some 90% of the heat flows through the case and the heat sink to the ambient environment. For most
packages, a better model is required.
4.3 Estimation with Junction-to-Board Thermal Resistance
A simple package thermal model which has demonstrated reasonable accuracy (about 20%) is a two-resistor model
consisting of a junction-to-board and a junction-to-case thermal resistance. The junction-to-case thermal resistance
covers the situation where a heat sink is used or where a substantial amount of heat is dissipated from the top of the
package. The junction-to-board thermal resistance describes the thermal performance when most of the heat is
conducted to the printed circuit board. It has been observed that the thermal performance of most plastic packages,
especially PBGA packages, is strongly dependent on the board temperature.
If the board temperature is known, an estimate of the junction temperature in the environment can be made using
the following equation:
where:
If the board temperature is known and the heat loss from the package case to the air can be ignored, acceptable
predictions of junction temperature can be made. For this method to work, the board and board mounting must be
similar to the test board used to determine the junction-to-board thermal resistance, namely a 2s2p (board with a
power and a ground plane) and by attaching the thermal balls to the ground plane.
4.4 Estimation Using Simulation
When the board temperature is not known, a thermal simulation of the application is needed. The simple two-resistor
model can be used with the thermal simulation of the application, or a more accurate and complex model of the
package can be used in the thermal simulation.
12
θJC
is device related and cannot be influenced by the user. The user adjusts the thermal environment to affect the
R
R
R
R
T
P
D
B
θJA
θJC
θCA
θJB
= board temperature (ºC)
= power dissipation in package
= junction-to-case thermal resistance (ºC/W)
= junction-to-board thermal resistance (ºC/W)
= junction-to-ambient thermal resistance (ºC/W)
= case-to-ambient thermal resistance (ºC/W)
R
T
J
θJA
= T
= R
B
+ (R
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
θJC
+ R
θJB
θCA
× P
D
)
θCA
. For instance, the user can change the air flow around the device, add a
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