MPC8270VVUPEA Freescale Semiconductor, MPC8270VVUPEA Datasheet - Page 72

• Manufacturer Part Number: MPC8270VVUPEA
• Description: IC MPU POWERQUICC II 480-TBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC IIr

Specifications of MPC8270VVUPEA

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 450MHz
• Voltage: 1.5V
• Mounting Type: Surface Mount
• Package / Case: 480-TBGA
• Processor Series: MPC8xxx
• Core: 603e
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 450 MHz
• Operating Supply Voltage: 0 V to 3 V
• Maximum Operating Temperature: + 105 C
• Data Ram Size: 32 KB
• Program Memory Size: 16 KB
• Program Memory Type: EPROM/Flash
• Core Size: 32 Bit
• Cpu Speed: 450MHz
• Embedded Interface Type: I2C, JTAG, SPI, UART
• Digital Ic Case Style: TBGA
• No. Of Pins: 480
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Package Description
9 Package Description
The following sections provide the package parameters and mechanical dimensions.
9.1 Package Parameters
Package parameters are provided in
72
1
2
3
4
5
6
7
Core Power
Ground
current, it is recommended to either pull unused pins to GND or VDDH, or to configure them as outputs.
signal on the MPC8275/MPC8270. New designs must connect B18 to GND and follow the suggestions in
Practices.” Old designs in which the MPC8275/MPC8270 is used as a drop-in replacement can leave the pin connected to
GND with the noise filtering capacitors.
external capacitor to operate the PLL. New designs should connect A18 (XFC) pin to GND. Old designs in which the
MPC8275/MPC8270 is used as a drop-in replacement can leave the pin connected to the current capacitor.
Should be tied to VDDH via a 2K Ω external pull-up resistor.
The default configuration of the CPM pins (PA[0–31], PB[4–31], PC[0–31], PD[4–31]) is input. To prevent excessive DC
Must be pulled down or left floating.
If PCI is not desired, must be pulled up or left floating.
Sphere is not connected to die.
GNDSYN (B18): This pin exists as a separate ground signal in MPC826x(A) devices; it does not exist as a separate ground
XFC (A18) pin: This pin is used in MPC826x(A) devices; it is not used in MPC8275/MPC8270 because there is no need for
MPC8275/MPC8270
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Pin Name
Table
24.
MPC8275 only
L3, V4, W3, AC11, AD11, AB15,
U25, T24, J24, H25, F23, B19, D17,
C17, D10, C10
B18
C18, D4, D6, G2, L4, P1, R1, R4,
AC4, AE7, AC23, Y25, N24, J23,
A23, D23, D20, E18, A13, A16, K10,
K11, K12, K13, K14, K15, K16, K17,
L10, L11, L12, L13, L14, L15, L16,
L17, M10, M11, M12, M13, M14,
M15, M16, M17, N10, N11, N12,
N13, N14, N15, N16, N17, P10, P11,
P12, P13, P14, P15, P16, P17, R10,
R11,R12, R13, R14, R15, R16, R17,
T10, T11, T12, T13, T14, T15, T16,
T17, U10, U11, U12, U13, U14, U15,
U16, U17
6
, A18
7
Freescale Semiconductor
, A2, B1, B2, A5, C5,
Ball
Section 4.6, “Layout