MK60DX256ZVLL10 Freescale Semiconductor, MK60DX256ZVLL10 Datasheet - Page 3

KINETIS 256KFLEX ENET

MK60DX256ZVLL10

Manufacturer Part Number
MK60DX256ZVLL10
Description
KINETIS 256KFLEX ENET
Manufacturer
Freescale Semiconductor
Datasheets

Specifications of MK60DX256ZVLL10

Processor Series
K60
Core
ARM Cortex M4
Data Bus Width
16 bit
Program Memory Type
Flash
Program Memory Size
256 KB
Data Ram Size
128 KB
Interface Type
USB, CAN, SPI, I2C, UART
Maximum Clock Frequency
100 MHz
Number Of Programmable I/os
2
Number Of Timers
2
Operating Supply Voltage
1.71 V to 3.6 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Package / Case
LQFP-100
Operating Temperature Range
- 40 C to + 105 C
Processor To Be Evaluated
MK60DX256ZVLL10
Supply Current (max)
185 mA
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MK60DX256ZVLL10
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
1 Ordering parts...........................................................................5
2 Part identification......................................................................5
3 Terminology and guidelines......................................................6
4 Ratings......................................................................................10
5 General.....................................................................................12
Freescale Semiconductor, Inc.
1.1 Determining valid orderable parts......................................5
2.1 Description.........................................................................5
2.2 Format...............................................................................5
2.3 Fields.................................................................................5
2.4 Example............................................................................6
3.1 Definition: Operating requirement......................................6
3.2 Definition: Operating behavior...........................................7
3.3 Definition: Attribute............................................................7
3.4 Definition: Rating...............................................................8
3.5 Result of exceeding a rating..............................................8
3.6 Relationship between ratings and operating
3.7 Guidelines for ratings and operating requirements............9
3.8 Definition: Typical value.....................................................9
3.9 Typical value conditions....................................................10
4.1 Thermal handling ratings...................................................11
4.2 Moisture handling ratings..................................................11
4.3 ESD handling ratings.........................................................11
4.4 Voltage and current operating ratings...............................11
5.1 Nonswitching electrical specifications...............................12
5.2 Switching specifications.....................................................21
5.3 Thermal specifications.......................................................23
requirements......................................................................8
5.1.1
5.1.2
5.1.3
5.1.4
5.1.5
5.1.6
5.1.7
5.1.8
5.2.1
5.2.2
5.3.1
5.3.2
Voltage and current operating requirements......12
LVD and POR operating requirements...............13
Voltage and current operating behaviors............14
Power mode transition operating behaviors.......15
Power consumption operating behaviors............16
EMC radiated emissions operating behaviors....20
Designing with radiated emissions in mind.........21
Capacitance attributes........................................21
Device clock specifications.................................21
General switching specifications.........................22
Thermal operating requirements.........................23
Thermal attributes...............................................23
K60 Sub-Family Data Sheet Data Sheet, Rev. 5, 5/2011.
Table of Contents
Preliminary
6 Peripheral operating requirements and behaviors....................24
7 Dimensions...............................................................................67
8 Pinout........................................................................................68
6.1 Core modules....................................................................24
6.2 System modules................................................................28
6.3 Clock modules...................................................................28
6.4 Memories and memory interfaces.....................................34
6.5 Security and integrity modules..........................................42
6.6 Analog...............................................................................42
6.7 Timers................................................................................56
6.8 Communication interfaces.................................................57
6.9 Human-machine interfaces (HMI)......................................66
7.1 Obtaining package dimensions.........................................67
6.1.1
6.1.2
6.3.1
6.3.2
6.3.3
6.4.1
6.4.2
6.4.3
6.6.1
6.6.2
6.6.3
6.6.4
6.8.1
6.8.2
6.8.3
6.8.4
6.8.5
6.8.6
6.8.7
6.8.8
6.8.9
6.8.10
6.8.11
6.9.1
Debug trace timing specifications.......................24
JTAG electricals..................................................25
MCG specifications.............................................28
Oscillator electrical specifications.......................31
32kHz Oscillator Electrical Characteristics.........33
Flash (FTFL) electrical specifications.................34
EzPort Switching Specifications.........................38
Flexbus Switching Specifications........................39
ADC electrical specifications..............................42
CMP and 6-bit DAC electrical specifications......50
12-bit DAC electrical characteristics...................52
Voltage reference electrical specifications..........55
Ethernet switching specifications........................57
USB electrical specifications...............................59
USB DCD electrical specifications......................59
USB VREG electrical specifications...................59
CAN switching specifications..............................60
DSPI switching specifications (low-speed
mode)..................................................................60
DSPI switching specifications (high-speed
mode)..................................................................62
I2C switching specifications................................63
UART switching specifications............................63
SDHC specifications...........................................63
I2S switching specifications................................64
TSI electrical specifications................................66
3

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