DS21348

Manufacturer Part NumberDS21348
Description3.3V E1/T1/J1 Line Interface
ManufacturerDallas Semiconducotr
DS21348 datasheet
 


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Page 60/73

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THERMAL CHARACTERISTICS OF DS21Q48 BGA PACKAGE
PARAMETER
Ambient Temperature
Junction Temperature
Theta-JA (θ
) in Still Air
JA
Theta-JC (θ
) in Still Air
JC
NOTES:
1) The package is mounted on a four-layer JEDEC-standard test board.
2) Theta-JA (θ
) is the junction to ambient thermal resistance, when the package is mounted on a four-
JA
layer JEDEC-standard test board.
3) While Theta-JC (θ
) is commonly used as the thermal parameter that provides a correlation between the
JC
junction temperature (T
) and the average temperature on top center of four of the chip-scale BGA
j
packages (T
), the proper term is Psi-JT. It is defined by:
C
The method of measurement of the thermal parameters is defined in EIA/JEDEC-standard document
EIA-JESD51-2.
THETA-JA (θ
) VERSUS AIRFLOW
JA
FORCED AIR (m/s)
THETA-JA (θ
0
1
2.5
MIN
TYP
-40ºC
-
-
-
-
+24ºC/W
-
+4.1ºC/W
(T
- T
) / overall package power
J
C
)
JA
24ºC/W
21ºC/W
19ºC/W
60 of 73
MAX
NOTES
+85ºC
1
+125ºC
-
2
-
3