S29GL256P10FFI022 Spansion, S29GL256P10FFI022 Datasheet - Page 12

• Manufacturer Part Number: S29GL256P10FFI022
• Description: Flash 256M, 3V, 110ns Parallel NOR Flash
• Manufacturer: Spansion

Specifications of S29GL256P10FFI022

• Rohs: yes
• Data Bus Width: 16 bit
• Memory Type: NOR Flash
• Memory Size: 256 Mbit
• Architecture: Uniform
• Timing Type: Asynchronous
• Interface Type: CFI
• Access Time: 100 ns
• Supply Voltage - Max: 3.6 V
• Supply Voltage - Min: 2.7 V
• Maximum Operating Current: 110 mA
• Operating Temperature: - 40 C to + 85 C
• Mounting Style: SMD/SMT
• Package / Case: FBGA-64
• Organization: 128 KB x 1024

3. Block Diagram
4. Physical Dimensions/Connection Diagrams
4.1
4.2
12
** A
A
Max
WP#/ACC
Max
RESET#
**–A0 (A-1)
BYTE#
GL01GP=A25, A
WE#
OE#
V
CE#
V
V
CC
SS
IO
Related Documents
Special Handling Instructions for BGA Package
This section shows the I/O designations and package specifications for the S29GL-P family.
The following documents contain information relating to the S29GL-P devices. Click on the title or go to
www.spansion.com
 Considerations for X-ray Inspection of Surface-Mounted Flash Integrated Circuits
Special handling is required for Flash Memory products in BGA packages.
Flash memory devices in BGA packages may be damaged if exposed to ultrasonic cleaning methods. The
package and/or data integrity may be compromised if the package body is exposed to temperatures above
150°C for prolonged periods of time.
Max
RY/BY#
V
CC
Command
GL512P = A24, A
Register
Control
State
Detector
Max
download the PDF file, or request a copy from your sales office.
GL256P = A23, A
PGM Voltage
Generator
Figure 3.1 S29GL-P Block Diagram
Timer
S29GL-P MirrorBit
Max
Sector Switches
GL128P = A22
Erase Voltage
Generator
D a t a
STB
®
Flash Family
Output Enable
Chip Enable
S h e e t
Logic
Y-Decoder
X-Decoder
S29GL-P_00_A14 October 22, 2012
STB
DQ15
Input/Output
Buffers
Cell Matrix
Y-Gating
Latch
Data
–
DQ0