S29GL256P10FFI022 Spansion, S29GL256P10FFI022 Datasheet - Page 76
S29GL256P10FFI022
Manufacturer Part Number
S29GL256P10FFI022
Description
Flash 256M, 3V, 110ns Parallel NOR Flash
Manufacturer
Spansion
Datasheet
1.S29GL128P11FFI022.pdf
(81 pages)
Specifications of S29GL256P10FFI022
Rohs
yes
Data Bus Width
16 bit
Memory Type
NOR Flash
Memory Size
256 Mbit
Architecture
Uniform
Timing Type
Asynchronous
Interface Type
CFI
Access Time
100 ns
Supply Voltage - Max
3.6 V
Supply Voltage - Min
2.7 V
Maximum Operating Current
110 mA
Operating Temperature
- 40 C to + 85 C
Mounting Style
SMD/SMT
Package / Case
FBGA-64
Organization
128 KB x 1024
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13. Advance Information on S29GL-S Eclipse 65 nm MirrorBit
76
Power-On and Warm Reset Timing
At power on, the flash requires additional time in the reset state to self configure than it does during a warm
reset.
the GL-P, and GL-S flash.
Notes:
1. N/A = Not Applicable.
2. For GL-S, t
Note:
The sum of t
Table 13.1
Parameter
t
t
t
t
t
t
VIOS
RPH
t
t
RPH
t
t
VCS
CEH
CEH
RP
RH
RP
RH
RP
RP
and t
+ t
RH
RH
and
must not be less than t
must be equal to or greater than t
Figure 13.1
Table 13.1 Power On and Warm Reset Timing Requirements
V
RESET# Low to RESET# High
RESET# Low to RESET# High
S29GL-P MirrorBit
V
CC
IO
RESET# High to CE# Low
RESET# High to CE# Low
RESET# Low to CE# Low
RESET# Low to CE# Low
Setup Time to first access
CE# High to CE# Low
CE# High to CE# Low
Setup Time to first access
and
Figure 13.1 Power-Up Reset Timing
RPH.
Description
Figure 13.2
RPH.
D a t a
®
Power on Reset
Flash Family
Warm Reset
detail the power on and warm reset timing requirements for
S h e e t
Type
min
min
min
min
min
min
min
min
min
min
S29GL-P_00_A14 October 22, 2012
200 ns
200 ns
GL-P
35 µs
35 µs
35 µs
35 µs
35 µs
35 µs
N/A
N/A
200 ns
200 ns
50 ns
50 ns
300 µs
300 µs
GL-S
35 µs
20 ns
35 µs
20 ns
(2)
(2)
(2)
(2)
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