S29GL256P10FFI022 Spansion, S29GL256P10FFI022 Datasheet - Page 66

• Manufacturer Part Number: S29GL256P10FFI022
• Description: Flash 256M, 3V, 110ns Parallel NOR Flash
• Manufacturer: Spansion

Specifications of S29GL256P10FFI022

• Rohs: yes
• Data Bus Width: 16 bit
• Memory Type: NOR Flash
• Memory Size: 256 Mbit
• Architecture: Uniform
• Timing Type: Asynchronous
• Interface Type: CFI
• Access Time: 100 ns
• Supply Voltage - Max: 3.6 V
• Supply Voltage - Min: 2.7 V
• Maximum Operating Current: 110 mA
• Operating Temperature: - 40 C to + 85 C
• Mounting Style: SMD/SMT
• Package / Case: FBGA-64
• Organization: 128 KB x 1024

Notes
1.
2. PA = program address, SA = sector address, PD = program data.
3. DQ7# is the complement of the data written to the device. D
4. Waveforms are for the word mode.
66
Figure 11.15
Addresses
RESET#
RY/BY#
indicates last two bus cycles of a program or erase operation.
WE#
Data
OE#
CE#
t
RH
555 for program
2AA for erase
Figure 11.15 Alternate CE# Controlled Write (Erase/Program) Operation Timings
t
t
t
WS
WH
WC
A0 for program
55 for erase
t
GHEL
t
t
t
DS
CP
PA for program
SA for sector erase
555 for chip erase
CPH
t
AS
t
S29GL-P MirrorBit
DH
OUT
is the data written to the device.
t
AH
PD for program
30 for sector erase
10 for chip erase
t
BUSY
D a t a
®
t
Flash Family
WHWH1 or 2
Data# Polling
S h e e t
DQ7#
PA
S29GL-P_00_A14 October 22, 2012
D
OUT