UPD70F3735GK-GAK-AX Renesas Electronics America, UPD70F3735GK-GAK-AX Datasheet - Page 761

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UPD70F3735GK-GAK-AX

Manufacturer Part Number
UPD70F3735GK-GAK-AX
Description
MCU 32BIT V850ES/JX3-L 80-LQFP
Manufacturer
Renesas Electronics America
Series
V850ES/Jx3-Lr
Datasheet

Specifications of UPD70F3735GK-GAK-AX

Core Processor
RISC
Core Size
32-Bit
Speed
20MHz
Connectivity
CSI, EBI/EMI, I²C, UART/USART
Peripherals
DMA, LVD, PWM, WDT
Number Of I /o
66
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.2 V ~ 3.6 V
Data Converters
A/D 8x10b, D/A 1x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
UPD70F3735GK-GAK-AX
Manufacturer:
Renesas Electronics America
Quantity:
10 000
V850ES/JF3-L
R01UH0017EJ0400 Rev.4.00
Sep 30, 2010
Notes 1. Address values vary depending on the product.
0000290H
00FFFFFH
0000070H
0000060H
0000000H
2. This is the address when CSIB0 is used. It starts at 0000310H when UARTA0 is used.
3. Address values vary depending on the product.
Note 1
Note 2
μ
μ
μ
μ
PD70F3735
PD70F3736
PD70F3735
PD70F3736
Figure 29-4. Memory Spaces Where Debug Monitor Programs Are Allocated
Interrupt vector for debugging
Access-prohibited area
interrupt vector (4 bytes)
CSI/UART receive
Security ID area
Internal ROM
Reset vector
(10 bytes)
(4 bytes)
(4 bytes)
(2 KB)
Internal ROM Size
Internal RAM Size
128 KB
256 KB
16 KB
8 KB
Internal ROM
area
001F800H to 001FFFFH
003F800H to 003FFFFH
Address Value
Address Value
3FFD000H
3FB9000H
3FFEFFFH
3FFEFF0H
Note 3
CHAPTER 29 ON-CHIP DEBUG FUNCTION
Access-prohibited area
Internal RAM
(16 bytes)
: Debugging area
Internal RAM
area
Page 745 of 816

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