XC3S250E-4FTG256C Xilinx Inc, XC3S250E-4FTG256C Datasheet - Page 116

IC SPARTAN-3E FPGA 250K 256-FTBG

XC3S250E-4FTG256C

Manufacturer Part Number
XC3S250E-4FTG256C
Description
IC SPARTAN-3E FPGA 250K 256-FTBG
Manufacturer
Xilinx Inc
Series
Spartan™-3Er
Datasheet

Specifications of XC3S250E-4FTG256C

Total Ram Bits
221184
Number Of Logic Elements/cells
5508
Number Of Labs/clbs
612
Number Of I /o
172
Number Of Gates
250000
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
256-LBGA
No. Of Logic Blocks
5508
No. Of Gates
250000
No. Of Macrocells
5508
No. Of Speed Grades
4
No. Of I/o's
190
Clock Management
DLL
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
122-1482

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0
Functional Description
116
05/30/06
10/02/06
11/09/06
03/16/07
05/29/07
04/18/08
08/26/09
Date
Version
3.2.1
3.3
3.4
3.5
3.6
3.7
3.8
Corrected various typos and incorrect links.
Clarified that the block RAM
the Industrial temperature range.
Updated the description of the
Alignment is no longer supported. Updated
input voltage tolerance. Replaced missing text in
Flash devices in
Flash in-system
software for STMicro and Atmel SPI PROMs. Updated
1 is in full production. Freshened various hyper links. Promoted Module 2 to Production
status.
Added information about new Spartan-3 Generation user guides
Available). Added cross-references to UG331: Spartan-3 Generation FPGA User Guide
and to UG332: Spartan-3 Generation Configuration User Guide. Added note about possible
JTAG configuration issues when the FPGA mode pins are set for Master mode and using
software prior to ISE 9.1.01i
pull-up resistors, including in
LDC[2:0] and HDC pins during
in this configuration mode.
Added information about HSWAP and PCI differences between steppings to
Removed “Performance Differences between Global Buffers” to match improved specs in
Module 3. Updated PROG_B pulse width descriptions to match specification in Module 3.
Corrected
recommended pull-up on DONE in
Persist of pins A20-A23. Updated Stepping description in
Stepping 1 is in production today. Updated links.
Added a frequency limitation to
a frequency limitation. Added a
page
the flash read access times in
Configuration Sequence, page
page
first paragraph in
62. Updated a Flash vendor name in
112. Revised the second paragraph in
Figure 6
Programming Support
Table
Ordering a Later Stepping, page
to show six taps and updated associated text. Added note for
www.xilinx.com
53. Updated parallel NOR Flash devices in
Readback
(JTAG
Figure
Input Delay
Table 62, page
Slave Parallel Mode
Equation 6, page
Spread Spectrum, page 58
103. Revised the first paragraph in
Table 55
Mode). Removed a few lingering references to “weak”
12. Removed vestigial references regarding the
feature is available either on the -5 speed grade or
Revision
was added beginning with ISE 8.1i iMPACT
Table 61, page
Functions. The
Figure
Production Stepping, page
and elsewhere. Added a caution regarding
90. Revised the first paragraph in
Clock
57. Added a new
5. Updated
configuration. These pins are not used
113.
Buffers/Multiplexers. Updated SPI
Table 71
Table 71
90. Removed the < symbol from
ODDR2
paragraph. Added
DS312-2 (v3.8) August 26, 2009
Table 6
and
(Design Documentation
Equation 7, page 57
Table
to note that only
flip-flop with C0 or C1
Power-On Behavior,
Table 72
for improved PCI
Product Specification
61. Direct, SPI
113. Revised the
Table
as Stepping
Table 42,
71.
with
R

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