XC3S250E-4FTG256C Xilinx Inc, XC3S250E-4FTG256C Datasheet - Page 155

• Manufacturer Part Number: XC3S250E-4FTG256C
• Description: IC SPARTAN-3E FPGA 250K 256-FTBG
• Manufacturer: Xilinx Inc
• Series: Spartan™-3Er

Specifications of XC3S250E-4FTG256C

• Total Ram Bits: 221184
• Number Of Logic Elements/cells: 5508
• Number Of Labs/clbs: 612
• Number Of I /o: 172
• Number Of Gates: 250000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 256-LBGA
• No. Of Logic Blocks: 5508
• No. Of Gates: 250000
• No. Of Macrocells: 5508
• No. Of Speed Grades: 4
• No. Of I/o's: 190
• Clock Management: DLL
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 122-1482

Table 117: Timing for the Slave Parallel Configuration Mode (Continued)
DS312-3 (v3.8) August 26, 2009
Product Specification
Notes:
1.
2.
3.
Hold Times
T
T
T
Clock Timing
T
T
F
SMCCD
SMCCCS
SMWCC
CCH
CCL
CCPAR
Symbol
The numbers in this table are based on the operating conditions set forth in
In the Slave Parallel mode, it is necessary to use the BUSY pin when the CCLK frequency exceeds this maximum specification.
Some Xilinx documents refer to Parallel modes as “SelectMAP” modes.
R
The time from the active edge of the CCLK pin to the point when data is last
held at the D0-D7 pins
The time from the active edge of the CCLK pin to the point when a logic level
is last held at the CSO_B pin
The time from the active edge of the CCLK pin to the point when a logic level
is last held at the RDWR_B pin
The High pulse width at the CCLK input pin
The Low pulse width at the CCLK input pin
Frequency of the clock
signal at the CCLK input
pin
No bitstream
compression
With bitstream compression
Description
www.xilinx.com
Not using the BUSY pin
Using the BUSY pin
Table
77.
DC and Switching Characteristics
(2)
All Speed Grades
Min
1.0
0
0
5
5
0
0
0
Max
50
66
20
-
-
-
-
-
Units
MHz
MHz
MHz
ns
ns
ns
ns
ns
155