XC3S250E-4FTG256C Xilinx Inc, XC3S250E-4FTG256C Datasheet - Page 78

• Manufacturer Part Number: XC3S250E-4FTG256C
• Description: IC SPARTAN-3E FPGA 250K 256-FTBG
• Manufacturer: Xilinx Inc
• Series: Spartan™-3Er

Specifications of XC3S250E-4FTG256C

• Total Ram Bits: 221184
• Number Of Logic Elements/cells: 5508
• Number Of Labs/clbs: 612
• Number Of I /o: 172
• Number Of Gates: 250000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 256-LBGA
• No. Of Logic Blocks: 5508
• No. Of Gates: 250000
• No. Of Macrocells: 5508
• No. Of Speed Grades: 4
• No. Of I/o's: 190
• Clock Management: DLL
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 122-1482

Functional Description
Table 53: Variant Select Codes for Various SPI Serial Flash PROMs
78
Notes:
1.
VS2 VS1 VS0
1
1
1
See iMPACT documentation for specific device support.
Others
1
0
1
1
1
0
FAST READ (0x0B)
(see
READ (0x03)
(see
READ ARRAY (0xE8)
(see
Reserved
Command
SPI Read
Figure
Figure
Figure
53)
53)
54)
Dummy
Bytes
1
0
4
STMicroelectronics (ST)
Atmel
Intel
Spansion (AMD, Fujitsu)
Winbond (NexFlash)
Macronix
Silicon Storage
Technology (SST)
Programmable
Microelectronics Corp.
(PMC)
AMIC Technology
Eon Silicon Solution, Inc.
STMicroelectronics (ST)
Spansion (AMD, Fujitsu)
Winbond (NexFlash)
Macronix
Silicon Storage
Technology (SST)
Programmable
Microelectronics Corp.
(PMC)
Atmel Corporation
SPI Serial Flash Vendor
www.xilinx.com
M25Pxx
M25PExx/M45PExx
AT45DB ‘D’-Series
Data Flash
AT26 / AT25
S33
S25FLxxxA
NX25
MX25Lxxxx
SST25LFxxxA
SST25VFxxxA
Pm25LVxxx
A25L
EN25
M25Pxx
M25PExx/M45PExx
S25FLxxxA
NX25
MX25Lxxxx
SST25LFxxxA
SST25VFxxxA
SST25VFxxx
Pm25LVxxx
AT45DB DataFlash
(use only ‘
Series for Industrial
temperature range
SPI Flash Family
/
/
W25
W25
C’ or ‘D’
DS312-2 (v3.8) August 26, 2009
(1)
)
Product Specification
Programming
Support
iMPACT
Yes
Yes
Yes
Yes
R