XC3S250E-4FTG256C Xilinx Inc, XC3S250E-4FTG256C Datasheet - Page 159

• Manufacturer Part Number: XC3S250E-4FTG256C
• Description: IC SPARTAN-3E FPGA 250K 256-FTBG
• Manufacturer: Xilinx Inc
• Series: Spartan™-3Er

Specifications of XC3S250E-4FTG256C

• Total Ram Bits: 221184
• Number Of Logic Elements/cells: 5508
• Number Of Labs/clbs: 612
• Number Of I /o: 172
• Number Of Gates: 250000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 256-LBGA
• No. Of Logic Blocks: 5508
• No. Of Gates: 250000
• No. Of Macrocells: 5508
• No. Of Speed Grades: 4
• No. Of I/o's: 190
• Clock Management: DLL
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 122-1482

Table 121: Configuration Timing Requirements for Attached Parallel NOR Flash
Table 122: MultiBoot Trigger (MBT) Timing
DS312-3 (v3.8) August 26, 2009
Product Specification
Notes:
1.
2.
3.
Notes:
1.
T
(t
T
(t
T
(t
T
(t
Symbol
ACC
OE
CE
ELQV
GLQV
AVQV
BYTE
FLQV,
Symbol
T
These requirements are for successful FPGA configuration in BPI mode, where the FPGA provides the CCLK frequency. The post
configuration timing can be different to support the specific needs of the application loaded into the FPGA and the resulting clock source.
Subtract additional printed circuit board routing delay as required by the application.
The initial BYTE# timing can be extended using an external, appropriately sized pull-down resistor on the FPGA’s LDC2 pin. The resistor
value also depends on whether the FPGA’s HSWAP pin is High or Low.
MultiBoot re-configuration starts on the rising edge after MBT is Low for at least the prescribed minimum period.
MBT
)
)
)
t
FHQV
R
)
MultiBoot Trigger (MBT) Low pulse width required to initiate
MultiBoot reconfiguration
Parallel NOR Flash PROM chip-select
time
Parallel NOR Flash PROM
output-enable time
Parallel NOR Flash PROM read access
time
For x8/x16 PROMs only: BYTE# to
output valid time
Description
(3)
Description
www.xilinx.com
T
ACC
≤
0.5T
CCLKn min
T
T
T
BYTE
CE
OE
Requirement
(
≤
≤
≤
T
Minimum
T
)
T
DC and Switching Characteristics
INITADDR
INITADDR
–
300
INITADDR
T
CCO
–
T
DCC
Maximum
–
∞
PCB
Units
Units
ns
ns
ns
ns
ns
159