XC3S250E-4FTG256C Xilinx Inc, XC3S250E-4FTG256C Datasheet - Page 7

• Manufacturer Part Number: XC3S250E-4FTG256C
• Description: IC SPARTAN-3E FPGA 250K 256-FTBG
• Manufacturer: Xilinx Inc
• Series: Spartan™-3Er

Specifications of XC3S250E-4FTG256C

• Total Ram Bits: 221184
• Number Of Logic Elements/cells: 5508
• Number Of Labs/clbs: 612
• Number Of I /o: 172
• Number Of Gates: 250000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 256-LBGA
• No. Of Logic Blocks: 5508
• No. Of Gates: 250000
• No. Of Macrocells: 5508
• No. Of Speed Grades: 4
• No. Of I/o's: 190
• Clock Management: DLL
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 122-1482

Ordering Information
Spartan-3E FPGAs are available in both standard and
Pb-free packaging options for all device/package combina-
tions. All devices are available in Pb-free packages, which
adds a ‘G’ character to the ordering code. All devices are
available in either Commercial (C) or Industrial (I) tempera-
Notes:
1.
2.
3.
Production Stepping
The Spartan-3E FPGA family uses production stepping to
indicate improved capabilities or enhanced features.
Stepping 1 is, by definition, a functional superset of Step-
ping 0. Furthermore, configuration bitstreams generated for
any stepping are forward compatible. See
tional details.
Xilinx has shipped both Stepping 0 and Stepping 1. Designs
operating on the Stepping 0 devices perform similarly on a
Stepping 1 device. Stepping 1 devices have been shipping
since 2006. The faster speed grade (-5), Industrial (I grade),
Automotive devices, and -4C devices with date codes 0901
(2009) and later, are always Stepping 1 devices. Only -4C
devices have shipped as Stepping 0 devices.
DS312-1 (v3.8) August 26, 2009
Product Specification
XC3S100E
XC3S250E
XC3S500E
XC3S1200E
XC3S1600E
Device
The –5 speed grade is exclusively available in the Commercial temperature range.
The XC3S500E VQG100 is available only in the -4 Speed Grade.
See
DS635
R
–4 Standard Performance
–5 High Performance
for the XA Automotive Spartan-3E FPGAs.
Speed Grade
Package Type
Speed Grade
Example:
Device Type
XC3S250E -4 FT 256 C
VQ100
VQG100
CP132
CPG132
TQ144
TQG144
PQ208
PQG208
FT256
FTG256
FG320
FGG320
FG400
FGG400
FG484
FGG484
Table 72
100-pin Very Thin Quad Flat Pack (VQFP)
132-ball Chip-Scale Package (CSP)
144-pin Thin Quad Flat Pack (TQFP)
208-pin Plastic Quad Flat Pack (PQFP)
256-ball Fine-Pitch Thin Ball Grid Array (FTBGA)
320-ball Fine-Pitch Ball Grid Array (FBGA)
400-ball Fine-Pitch Ball Grid Array (FBGA)
484-ball Fine-Pitch Ball Grid Array (FBGA)
for addi-
Package Type / Number of Pins
www.xilinx.com
ture ranges. Both the standard –4 and faster –5 speed
grades are available for the Commercial temperature range.
However, only the –4 speed grade is available for the Indus-
trial temperature range. See
age combinations.
To specify only the later stepping for the -4C, append an S#
suffix to the standard ordering code, where # is the stepping
number, as indicated in
Table 3: Spartan-3E Optional Stepping Level Ordering
The stepping level is optionally marked on the device using
a single number character, as shown in
and
S1
Stepping
Number
Figure
(optional code to specify Stepping 1)
Temperature Range
Number of Pins
0
1
4.
Suffix Code
None or S0
S1
Table
DS312_03_082409
Table 2
3.
C Commercial (0°C to 85°C)
I Industrial (–40°C to 100°C)
Temperature Range (T
for valid device/pack-
Production
Production
Figure
Status
2,
Figure
J
)
3,
7