AD9146 Analog Devices, AD9146 Datasheet - Page 8

• Manufacturer Part Number: AD9146
• Description: Dual, 16-Bit, 1230 MSPS, TxDAC+® Digital-to-Analog Converter
• Manufacturer: Analog Devices

Specifications of AD9146

• Resolution (bits): 16bit
• Dac Update Rate: 1.23GSPS
• Dac Settling Time: n/a
• Max Pos Supply (v): +3.47V
• Single-supply: No
• Dac Type: Current Out
• Dac Input Format: Byte,LVDS,Nibble

AD9146
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
AVDD33 to AVSS, EPAD, CVSS
DVDD18, CVDD18 to AVSS, EPAD,
AVSS to EPAD, CVSS
EPAD to AVSS, CVSS
CVSS to AVSS, EPAD
FSADJ, REFIO, IOUT1P, IOUT1N,
D[7:0]P, D[7:0]N, FRAMEP, FRAMEN,
DACCLKP, DACCLKN, REFCLKP,
RESET, IRQ, CS, SCLK, SDIO to EPAD
Junction Temperature
Storage Temperature Range
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
CVSS
IOUT2P, IOUT2N to AVSS
DCIP, DCIN to EPAD
REFCLKN to EPAD
Rating
−0.3 V to +3.6 V
−0.3 V to +2.1 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to AVDD33 + 0.3 V
−0.3 V to DVDD18 + 0.3 V
−0.3 V to CVDD18 + 0.3 V
−0.3 V to DVDD18 + 0.3 V
125°C
−65°C to +150°C
Rev. A | Page 8 of 56
THERMAL RESISTANCE
The exposed pad (EPAD) of the 48-lead LFCSP must be soldered
to the ground plane (AVSS). The EPAD provides an electrical,
thermal, and mechanical connection to the board.
Typical θ
an 8-layer board in still air. Airflow increases heat dissipation,
effectively reducing θ
Table 7. Thermal Resistance
Package
48-Lead LFCSP
48-Lead LFCSP
1
ESD CAUTION
EPAD soldered to ground plane.
JA
1
, θ
JB
, and θ
JC
JA
PCB
4-layer
8-layer
values are specified for a 4-layer board and
and θ
JB
.
θ
23.2
16.4
JA
θ
8.5
3.9
JB
Data Sheet
θ
8.7
7.1
JC
Unit
°C/W
°C/W