ST72361AR9-Auto STMicroelectronics, ST72361AR9-Auto Datasheet - Page 259
ST72361AR9-Auto
Manufacturer Part Number
ST72361AR9-Auto
Description
8-bit MCU for automotive with K Flash, 10-bit ADC, 5 Timers, SPI, 2x LINSCI
Manufacturer
STMicroelectronics
Datasheet
1.ST72361AR9-AUTO.pdf
(279 pages)
Specifications of ST72361AR9-Auto
Hdflash Endurance
100 cycles, data retention 20 years at 55 °C
5 Power Saving Modes
halt, auto wake up from halt, active halt, wait and slow
- Current page: 259 of 279
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ST72361xx-Auto
20.3
20.4
Thermal characteristics
1. The maximum power dissipation is obtained from the formula P
2. The maximum chip-junction temperature is based on technology characteristics.
Packaging for automatic handling
The devices can be supplied in trays or with tape and reel conditioning.
Tape and reel conditioning can be ordered with pin 1 left-oriented or right-oriented when
facing the tape sprocket holes as shown in
Figure 127. pin 1 orientation in tape and reel conditioning
See also
and
of an application can be defined by the user with the formula: P
internal power (I
application.
Figure 129: ST72P361xxx-Auto FastROM commercial product structure on page
Symbol
T
R
Jmax
P
thJA
Figure 128: ST72F361xx-Auto Flash commercial product structure on page 264
D
Pin 1
DD
x V
Package thermal resistance (junction to
ambient)
LQFP64
LQFP44
LQFP32
Power dissipation
Maximum junction temperature
Left orientation
DD
) and P
PORT
Doc ID 12468 Rev 3
is the port power dissipation depending on the ports used in the
(1)
Ratings
Figure
(2)
127.
Right orientation (EIA 481-C compliant)
D
D
= (T
= P
INT
J
- T
+ P
A
) / R
PORT
Package characteristics
thJA
where P
. The power dissipation
Value
Pin 1
500
150
60
52
70
INT
is the chip
259/279
°C/W
Unit
mW
265.
°C
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