TMPM364F10FG Toshiba, TMPM364F10FG Datasheet - Page 830
TMPM364F10FG
Manufacturer Part Number
TMPM364F10FG
Description
Manufacturer
Toshiba
Datasheet
1.TMPM364F10FG.pdf
(838 pages)
Specifications of TMPM364F10FG
Product Summaries
Summary
Lead Free
Yes
Rohs Compatible Product(s)
Available
Rom (kbytes)
1024K
Rom Type
Flash
Ram (kbytes)
64K
Number Of Pins
144
Package
LQFP(20x20)
Vcc
3V
Cpu Mhz
64
Ssp (ch) Spi
1
I2c/sio (ch)
5
Uart/sio (ch)
12
Usb
Host
Can
1
Ethernet
-
External Bus Interface
Y
Cs/wait Controller (ch)
4
Dma Controller
2
10-bit Da Converter
-
10-bit Ad Converter
16
12-bit Ad Converter
-
16-bit Timer / Counter
16
Motor / Igbt Control
-
Real Time Clock
Y
Watchdog Timer
Y
Osc Freq Detect
-
Clock Gear
Y
Low-power Hold Function
Y
Remote Control Interface
Y
Hardware Cec Controller
Y
Comparators
-
Low-voltage Detector
-
Etm Hardware Trace
4-bit
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27.9
Handling Precaution
27.9
27.9.1
27.9.2
RVDD3,
DVDD3A,
DVDD3B,
AVDD3
RESET
High-frequecny oscillation
Handling Precaution
TX03, the internal regulator requires at least 700 μs to be stable.
must be kept "Low" for a duration of time sufficiently long enough for the internal regulator and oscillator to
be stable.
Test parameter
The power supply must be raised (from 0V to 2.7V) at a speed of 0.1ms/V or slower.
The power-on sequence must consider the time for the internal regulator and oscillator to be stable. In the
The time required to achieve stable oscillation varies with system. At cold reset, the external reset pin
The power-on sequence is shown as below ;
Solderability
Solderability
Power-on sequence
2.7 V
0 V
Use of Sn-37Pb solder Bath
Solder bath temperature = 230°C, Dipping time = 5 seconds
The number of times = one, Use of R-type flux
Use of Sn-3.0Ag-0.5Cu solder bath
Solder bath temperature = 245°C, Dipping time = 5 seconds
The number of times = one, Use of R-type flux
0.1ms/V
(min)
Test condition
Page 804
700 ms(min)
12 cycle (min)
Pass:
solderability rate until forming ≥ 95%
Note
TMPM364F10FG
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