TMPM364F10FG Toshiba, TMPM364F10FG Datasheet - Page 830

• Manufacturer Part Number: TMPM364F10FG
• Manufacturer: Toshiba

Specifications of TMPM364F10FG

• Product Summaries: Summary
• Lead Free: Yes
• Rohs Compatible Product(s): Available
• Rom (kbytes): 1024K
• Rom Type: Flash
• Ram (kbytes): 64K
• Number Of Pins: 144
• Package: LQFP(20x20)
• Vcc: 3V
• Cpu Mhz: 64
• Ssp (ch) Spi: 1
• I2c/sio (ch): 5
• Uart/sio (ch): 12
• Usb: Host
• Can: 1
• Ethernet: -
• External Bus Interface: Y
• Cs/wait Controller (ch): 4
• Dma Controller: 2
• 10-bit Da Converter: -
• 10-bit Ad Converter: 16
• 12-bit Ad Converter: -
• 16-bit Timer / Counter: 16
• Motor / Igbt Control: -
• Real Time Clock: Y
• Watchdog Timer: Y
• Osc Freq Detect: -
• Clock Gear: Y
• Low-power Hold Function: Y
• Remote Control Interface: Y
• Hardware Cec Controller: Y
• Comparators: -
• Low-voltage Detector: -
• Etm Hardware Trace: 4-bit

27.9
Handling Precaution
27.9
27.9.1
27.9.2
RVDD3,
DVDD3A,
DVDD3B,
AVDD3
RESET
High-frequecny oscillation
Handling Precaution
TX03, the internal regulator requires at least 700 μs to be stable.
must be kept "Low" for a duration of time sufficiently long enough for the internal regulator and oscillator to
be stable.
Test parameter
The power supply must be raised (from 0V to 2.7V) at a speed of 0.1ms/V or slower.
The power-on sequence must consider the time for the internal regulator and oscillator to be stable. In the
The time required to achieve stable oscillation varies with system. At cold reset, the external reset pin
The power-on sequence is shown as below ;
Solderability
Solderability
Power-on sequence
2.7 V
0 V
Use of Sn-37Pb solder Bath
Solder bath temperature = 230°C, Dipping time = 5 seconds
The number of times = one, Use of R-type flux
Use of Sn-3.0Ag-0.5Cu solder bath
Solder bath temperature = 245°C, Dipping time = 5 seconds
The number of times = one, Use of R-type flux
0.1ms/V
(min)
Test condition
Page 804
700 ms(min)
12 cycle (min)
Pass:
solderability rate until forming ≥ 95%
Note
TMPM364F10FG