MT9VDDT6472HY-40B Micron Semiconductor Products, MT9VDDT6472HY-40B Datasheet - Page 22

• Manufacturer Part Number: MT9VDDT6472HY-40B
• Description: 256mb, 512mb, 1gb X72, Ecc, Sr 200-pin Ddr Sodimm
• Manufacturer: Micron Semiconductor Products

NOTE:
pdf: 09005aef811d6080, source: 09005aef806e057b
DDA9C32_64_128x72HG.fm - Rev. B 06/05 EN
1. Micron Technology, Inc. recommends a minimum air flow of 1 meter/second (~197 LFM) across all modules.
2. The component case temperature measurements shown above were obtained experimentally. The typical system to be
3. Temperature versus air speed data is obtained by performing experiments with the system motherboard removed from
4. The memory diagnostic software used for determining worst-case component temperatures is a memory diagnostic soft-
used for experimental purposes is a dual-processor 600 MHz work station, fully loaded, with four comparable registered
memory modules. Case temperatures charted represent worst-case component locations on modules installed in the
internal slots of the system.
its case and mounted in a Eiffel-type low air speed wind tunnel. Peripheral devices installed on the system motherboard
for testing are the processor(s) and video card, all other peripheral devices are mounted outside of the wind tunnel test
chamber.
ware application developed for internal use by Micron Technology, Inc.
100
90
80
70
60
50
40
30
20
Figure 10: Component Case Temperature vs. Air Flow
T
T
max
ave
- memory stress software
- memory stress software
T
ave
Air Flow (meters/sec)
- 3D gaming software
256MB, 512MB, 1GB (x72, ECC, SR)
22
Micron Technology, Inc., reserves the right to change products or specifications without notice.
200-PIN DDR SODIMM
Ambient Temperature = 25º C
Minimum Air Flow
©2005 Micron Technology, Inc. All rights reserved.