mt48h16m32lfcm-75-it Micron Semiconductor Products, mt48h16m32lfcm-75-it Datasheet - Page 12

• Manufacturer Part Number: mt48h16m32lfcm-75-it
• Description: 512mb 32 Meg X 16, 16 Meg X 32 Mobile Sdram Features
• Manufacturer: Micron Semiconductor Products

Package Dimensions
Figure 6:
PDF: 09005aef82ea3742/Source: 09005aef82ea371a
512mb_mobile_sdram_y47m__2.fm - Rev. B 4/08 EN
condition. The pre-
reflow balls are
diameter refers
SMD ball pads.
Ø0.42 on Ø0.4
to post reflow
54X Ø0.45
Seating
plane
6.4
Solder ball
0.1 A
0.8 TYP
54-Ball VFBGA (8mm x 9mm)
3.2
Notes:
A
9
1. All dimensions are in millimeters.
8
3.2
7
8 ±0.1
6.4
4 ±0.05
3
2
1
512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM
A
B
C
D
E
F
G
H
J
0.8
TYP
4.5 ±0.05
0.65 ±0.05
12
Ball A1 ID
9 ± 0.1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.0 MAX
Mold compound: epoxy novolac
Solder ball material:
Substrate material: plastic laminate
SAC105 (98.5% Sn, 1% Ag, 0.5% Cu)
Package Dimensions
©2007 Micron Technology, Inc. All rights reserved.
Micron logo
to be lased
ball A1 ID