mt47h64m16hw-3 Micron Semiconductor Products, mt47h64m16hw-3 Datasheet - Page 19

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mt47h64m16hw-3

Manufacturer Part Number
mt47h64m16hw-3
Description
1gb X4, X8, X16 Ddr2 Sdram
Manufacturer
Micron Semiconductor Products
Datasheet

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Package Dimensions
Figure 10:
PDF: 09005aef821ae8bf/Source: 09005aef821aed36
1Gb_DDR2_x4x8x16_D2.fm - 1Gb DDR2: Rev. N; Core DDR2: Rev. C 4/08 EN
Dimensions
apply to solder
balls post reflow.
60X Ø0.45
Seating
0.12 A
plane
8
0.8 TYP
0.8 TYP
60-Ball FBGA Package – x4, x8
A
Notes:
9
8
1. All dimensions are in millimeters.
7
8 ±0.15
6.4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
11.5 ±0.15
0.8 ±0.1
Ball A1 ID
19
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.20 MAX
1Gb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
Package Dimensions
©2004 Micron Technology, Inc. All rights reserved.
Ball A1 ID

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