pnx1700 NXP Semiconductors, pnx1700 Datasheet - Page 228
pnx1700
Manufacturer Part Number
pnx1700
Description
Connected Media Processor
Manufacturer
NXP Semiconductors
Datasheet
1.PNX1700.pdf
(832 pages)
- Current page: 228 of 832
- Download datasheet (8Mb)
Philips Semiconductors
Volume 1 of 1
Table 4: NAND Address Mux Table
PNX17XX_SER_1
Preliminary data sheet
Num. of
Addresses
3
3
2
2
1
3
t
t
t
Figure 2:
WH
WL
RL
: (REN_lo + 1) * pci_clk periodShown with REN_lo = 1
: (WEN_lo + 1) * pci_clk periodShown with WEN_lo = 0
: (WEN_hi + 1) * pci_clk period Shown with WEN_hi = 0
pci_clk
frame
WEN
REN
CLE
trdy
irdy
CS
IO
Read Status
Block size
SB
SB
SB
SB
SB
SB
The ACK may be monitored to determine when the device is ready prior to initiating
the DMA. Once the device is ready, no further monitoring of the ACK takes place. If
the amount of data to be transferred exceeds one segment, the max burst size should
be set to 128 to allow for pause in the transfer that allows the ACK to be monitored
between segments. Note that this approach will not pause at the correct location if the
spare area is being accessed.
Misc
Settings
64 MB, 8 bit
32 MB, 8 bit
64 MB, 8 bit
32 MB, 8 bit
Any MB, 8 bit addr[24:17]
32 MB, 8 bit
Examples of block erase, data read and write and status read are shown in the
following timing diagrams.
1st Address
addr[7:0]
addr[7:0]
addr[16:9]
addr[16:9]
addr[8:1]
command_a
Rev. 1 — 17 March 2006
t
WL
t
WH
2nd Address 3rd Address 4th Address
addr[16:9]
addr[16:9]
addr[24:17]
addr[24:17]
-NA-
addr[16:9]
addr[24:17]
addr[24:17]
addr[25]
-NA-
-NA-
adr[24:17]
t
status
RL
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
addr[25]
-NA-
-NA-
-NA-
-NA-
-NA-
Chapter 7: PCI-XIO Module
PNX17xx Series
7-7
Related parts for pnx1700
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2468 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2470 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2478 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The XA-S3 device is a member of Philips Semiconductors? XA(eXtended Architecture) family of high performance 16-bitsingle-chip microcontrollers
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP BlueStreak LH75401/LH75411 family consists of two low-cost 16/32-bit System-on-Chip (SoC) devices
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB2
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3141 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3143 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3152 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3154 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using NXP High-Performance Automotive (HPA) TrenchMOS technology
Manufacturer:
NXP Semiconductors
Datasheet: