se97b NXP Semiconductors, se97b Datasheet - Page 2

• Manufacturer Part Number: se97b
• Description: Ddr Memory Module Temp Sensor With Integrated Spd
• Manufacturer: NXP Semiconductors

NXP Semiconductors
Table 1.
2. Features
SE97B_1
Product data sheet
Feature
JEDEC specification
Bit 8 ‘1’ Thermal Sensor shutdown
Bit 8 ‘0’ Thermal Sensor active
I
I
Capabilities bit 6 SMBus Timeout
EVENT pin operation
Capabilities bit 7 EVENT pin
A0 pin is 10 V tolerant
Capabilities bit 5 VHV
I
I
SE97 Device ID register
Revision ID register
Temperature Sensor accuracy
Power-On Reset (POR)
Temperature Sensor voltage range
EEPROM Write voltage range
EEPROM Read voltage range
2 mm × 3 mm × 0.8 mm package
2
2
2
2
C-bus maximum frequency
C SCL and SDA V
C spike suppression
C input hysteresis
Comparison of SE97 versus SE97B features
2.1 General features
2.2 Temperature sensor features
IL
/V
IH
voltage levels
JEDEC (JC-42.4) DIMM temperature sensor plus 256-byte serial EEPROM for Serial
Presence Detect (SPD)
SDA open-drain output design for best operation in distributed multi-point applications
Shutdown current: 0.1 μA (typ.) and 5.0 μA (max.)
Power-on reset: 1.8 V (typ.)
2-wire interface: I
SMBus Alert Response Address and TIMEOUT 25 ms to 35 ms (programmable)
ESD protection exceeds 2500 V HBM per JESD22-A114, 250 V MM per
JESD22-A115, and 1000 V CDM per JESD22-C101
Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
Available in HWSON8 package
11-bit ADC Temperature-to-Digital converter with 0.125 °C resolution
Voltage range: 3.0 V to 3.6 V
Operating current: 250 μA (typ.) and 400 μA (max.)
SMBus Timeout 25 ms to 35 ms
2
assembly plant Hong Kong
C-bus/SMBus compatible, 0 Hz to 400 kHz
Rev. 01 — 27 January 2010
old JEDEC specification
no SMBus Timeout
1.7 V to 3.6 V
0000 0001
Grade B
set to 0
set to 0
set to 0
DDR memory module temp sensor with integrated SPD
frozen
SE97
0.6 V
-
V
IL(max)
= 0.3 × V
3.0 V to 3.6 V
3.0 V to 3.6 V
1010 0010
400 kHz
DD
50 ns
yes
; V
IH(min)
SMBus Timeout 25 ms to 35 ms
(thicker die and leadframe)
new JEDEC specification
= 0.7 × V
assembly plant Bangkok
Improved Grade B
3.0 V to 3.6 V
0.05 × V
0000 0011
de-assert
set to 1
set to 1
set to 1
SE97B
DD
1.8 V
© NXP B.V. 2010. All rights reserved.
DD
SE97B
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