se97b NXP Semiconductors, se97b Datasheet - Page 5

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se97b

Manufacturer Part Number
se97b
Description
Ddr Memory Module Temp Sensor With Integrated Spd
Manufacturer
NXP Semiconductors
Datasheet

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NXP Semiconductors
6. Pinning information
SE97B_1
Product data sheet
6.1 Pinning
6.2 Pin description
Table 3.
Symbol
A0
A1
A2
V
SDA
SCL
EVENT
V
Fig 2.
SS
DD
Pin configuration for HWSON8
Pin description
Pin
1
2
3
4
5
6
7
8
Type
I
I
I
ground
I/O
I
O
power
Rev. 01 — 27 January 2010
terminal 1
index area
device ground
Description
I
input is overvoltage tolerant to support software write protection.
I
I
SMBus/I
external pull-up resistor.
SMBus/I
external pull-up resistor.
Thermal alarm output for high/low and critical temperature limit
(open-drain). Must have external pull-up resistor.
device power supply (3.0 V to 3.6 V)
DDR memory module temp sensor with integrated SPD
2
2
2
V
C-bus/SMBus slave address bit 0 with internal pull-down. This
C-bus/SMBus slave address bit 1 with internal pull-down
C-bus/SMBus slave address bit 2 with internal pull-down
A0
A1
A2
SS
1
2
3
4
2
2
C-bus serial data input/output (open-drain). Must have
C-bus serial clock input/output (open-drain). Must have
Transparent top view
SE97BTP
002aae311
8
7
6
5
V
EVENT
SCL
SDA
DD
© NXP B.V. 2010. All rights reserved.
SE97B
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