se97b NXP Semiconductors, se97b Datasheet - Page 52
se97b
Manufacturer Part Number
se97b
Description
Ddr Memory Module Temp Sensor With Integrated Spd
Manufacturer
NXP Semiconductors
Datasheet
1.SE97B.pdf
(53 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
se97bTP
Manufacturer:
NXP
Quantity:
10 000
Company:
Part Number:
se97bTP
Manufacturer:
NXP
Quantity:
7 250
Company:
Part Number:
se97bTP/L547
Manufacturer:
NEC
Quantity:
6 586
NXP Semiconductors
18. Contents
1
2
2.1
2.2
2.3
3
4
5
6
6.1
6.2
7
7.1
7.2
7.3
7.3.1
7.3.2
7.3.2.1
7.3.2.2
7.3.3
7.3.3.1
7.3.3.2
7.3.3.3
7.4
7.4.1
7.5
7.6
7.7
7.8
7.9
7.10
7.10.1
7.10.1.1
7.10.1.2
7.10.1.3
7.10.2
7.10.2.1
7.10.2.2
7.10.2.3
SE97B_1
Product data sheet
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 6
EVENT output condition . . . . . . . . . . . . . . . . . . 7
EVENT pin output voltage levels
and resistor sizing. . . . . . . . . . . . . . . . . . . . . . . 7
EVENT thresholds . . . . . . . . . . . . . . . . . . . . . . 9
EVENT operation modes . . . . . . . . . . . . . . . . 10
Switching between Comparator mode
and Interrupt mode . . . . . . . . . . . . . . . . . . . . . 10
What temperature is read when conversion
is in progress . . . . . . . . . . . . . . . . . . . . . . . . . 11
SMBus Alert Response Address
(ARA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Clear Reversible Write Protection (CRWP) . . 19
Read Reversible Write Protection (RRWP),
and Read Clear Reversible Write Protection
(RCRWP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
General features . . . . . . . . . . . . . . . . . . . . . . . . 2
Temperature sensor features . . . . . . . . . . . . . . 2
Serial EEPROM features . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
Serial bus interface . . . . . . . . . . . . . . . . . . . . . . 6
Slave address . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Alarm window . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Critical trip. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Comparator mode. . . . . . . . . . . . . . . . . . . . . . 10
Interrupt mode . . . . . . . . . . . . . . . . . . . . . . . . 10
Conversion rate . . . . . . . . . . . . . . . . . . . . . . . 11
Power-up default condition . . . . . . . . . . . . . . . 11
Device initialization . . . . . . . . . . . . . . . . . . . . . 11
SMBus TIMEOUT . . . . . . . . . . . . . . . . . . . . . . 12
SMBus/I
EEPROM operation . . . . . . . . . . . . . . . . . . . . 15
Write operations . . . . . . . . . . . . . . . . . . . . . . . 16
Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Acknowledge polling . . . . . . . . . . . . . . . . . . . . 17
Memory Protection . . . . . . . . . . . . . . . . . . . . . 17
Permanent Write Protection (PWP) . . . . . . . . 18
Reversible Write Protection (RWP) and
Read Permanent Write Protection (RPWP),
2
C-bus interface . . . . . . . . . . . . . . . . 13
Rev. 01 — 27 January 2010
DDR memory module temp sensor with integrated SPD
7.10.3
7.10.3.1
7.10.3.2
7.10.3.3
8
8.1
8.2
8.3
8.4
8.5
8.5.1
8.5.2
8.5.3
8.6
8.7
8.8
8.9
9
9.1
9.2
9.3
9.4
10
11
12
13
13.1
13.2
13.3
13.4
14
15
16
16.1
16.2
16.3
16.4
Register descriptions . . . . . . . . . . . . . . . . . . . 22
Application design-in information. . . . . . . . . 35
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 38
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 38
Package outline. . . . . . . . . . . . . . . . . . . . . . . . 46
Soldering of SMD packages . . . . . . . . . . . . . . 47
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 49
Revision history . . . . . . . . . . . . . . . . . . . . . . . 50
Legal information . . . . . . . . . . . . . . . . . . . . . . 51
Read operations. . . . . . . . . . . . . . . . . . . . . . . 20
Current address read . . . . . . . . . . . . . . . . . . . 20
Selective read . . . . . . . . . . . . . . . . . . . . . . . . 20
Sequential read . . . . . . . . . . . . . . . . . . . . . . . 21
Register overview . . . . . . . . . . . . . . . . . . . . . 22
CAP — Capability register
(00h, 16-bit read-only) . . . . . . . . . . . . . . . . . . 23
CONFIG — Configuration register
(01h, 16-bit read/write). . . . . . . . . . . . . . . . . . 24
Temperature format . . . . . . . . . . . . . . . . . . . . 28
Temperature Trip Point registers . . . . . . . . . . 29
UPPER — Upper Boundary Alarm Trip
register (02h, 16-bit read/write) . . . . . . . . . . . 29
LOWER — Lower Boundary Alarm Trip
register (03h, 16-bit read/write) . . . . . . . . . . . 30
CRITICAL — Critical Alarm Trip register
(04h, 16-bit read/write). . . . . . . . . . . . . . . . . . 30
TEMP — Temperature register
(05h, 16-bit read-only) . . . . . . . . . . . . . . . . . . 31
MANID — Manufacturer’s ID register
(06h, 16-bit read-only) . . . . . . . . . . . . . . . . . . 32
DEVICEID — Device ID register
(07h, 16-bit read-only) . . . . . . . . . . . . . . . . . . 32
SMBUS — SMBus register
(22h, 8-bit read/write). . . . . . . . . . . . . . . . . . . 33
SE97B in memory module application . . . . . . 36
Layout consideration . . . . . . . . . . . . . . . . . . . 36
Thermal considerations . . . . . . . . . . . . . . . . . 36
Hot plugging. . . . . . . . . . . . . . . . . . . . . . . . . . 37
Introduction to soldering. . . . . . . . . . . . . . . . . 47
Wave and reflow soldering. . . . . . . . . . . . . . . 47
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . 47
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . 48
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 51
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 51
© NXP B.V. 2010. All rights reserved.
SE97B
continued >>
52 of 53