se97b NXP Semiconductors, se97b Datasheet - Page 49

• Manufacturer Part Number: se97b
• Description: Ddr Memory Module Temp Sensor With Integrated Spd
• Manufacturer: NXP Semiconductors

NXP Semiconductors
14. Abbreviations
SE97B_1
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
Table 35.
Acronym
ADC
ARA
CDM
CPU
DDR
DIMM
DRAM
EEPROM
ESD
HBM
I
LSB
MM
MSB
PC
PCB
POR
2
Fig 42. Temperature profiles for large and small components
C-bus
temperature
MSL: Moisture Sensitivity Level
Abbreviations
Description
A-to-D Converter
Alert Response Address
Charged Device Model
Central Processing Unit
Double Data Rate
Dual In-line Memory Module
Dynamic Random Access Memory
Electrically Erasable Programmable Read-Only Memory
ElectroStatic Discharge
Human Body Model
Inter-Integrated Circuit bus
Least Significant Bit
Machine Model
Most Significant Bit
Personal Computer
Printed-Circuit Board
Power-On Reset
Rev. 01 — 27 January 2010
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
DDR memory module temp sensor with integrated SPD
= MSL limit, damage level
temperature
peak
© NXP B.V. 2010. All rights reserved.
001aac844
SE97B
time
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