se97b NXP Semiconductors, se97b Datasheet - Page 37

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se97b

Manufacturer Part Number
se97b
Description
Ddr Memory Module Temp Sensor With Integrated Spd
Manufacturer
NXP Semiconductors
Datasheet

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NXP Semiconductors
SE97B_1
Product data sheet
9.4 Hot plugging
Calculation example:
Self heating due to power dissipation is:
The SE97B can be used in hot plugging applications. Internal circuitry prevents damaging
current backflow through the device when it is powered down, but with the I
EVENT or address pins still connected. The open-drain SDA and EVENT pins (SCL and
address pins are input only) effectively places the outputs in a high-impedance state
during power-up and power-down, which prevents driver conflict and bus contention. The
50 ns noise filter will filter out any insertion glitches from the state machine, which is very
robust and not prone to false operation.
The device needs a proper power-up sequence to reset itself, not only for the device
I
into its operational registers. The power-up sequence should occur correctly with a fast
ramp rate and the I
power-up, but it should not damage the part if the power-up sequence is abnormal. If the
SCL line is held LOW, the part will not exit the power-on reset mode since the part is held
in reset until SCL is released.
ΔT
2
C-bus and I/O initial states, but also to load specific pre-defined data or calibration data
V
V
I
I
T
I
V
Maximum V
I
V
I
R
OL(sink)(SDA)
OL(sink)EVENT
DD(AV)
OL(sink)(SDA)
OL(sink)EVENT
amb
OL(SDA)
OL(EVENT)
DD
OL(EVENT)
th(j-a)
=
= 3.6 V
56
(typical temperature inside the notebook) = 50 °C
= 56 °C/W
= 400 μA
×
= LOW-level output voltage on pin SDA
[
(
3.6
= LOW-level output voltage on pin EVENT
= 0.4 V
OL(SDA)
= SDA output current LOW
= 1 mA
= EVENT output current LOW
= 3 mA
×
0.4
2
C-bus active. The SE97B might not respond immediately after
)
= 0.4 V
Rev. 01 — 27 January 2010
+
(
0.4
×
DDR memory module temp sensor with integrated SPD
3
)
+
(
0.4
×
1
)
]
=
56 °C W
×
3.04 mW
=
0.17 °C
© NXP B.V. 2010. All rights reserved.
SE97B
2
C-bus,
37 of 53
(2)

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