AGL015 MICROSEMI [Microsemi Corporation], AGL015 Datasheet - Page 184

• Manufacturer Part Number: AGL015
• Description: IGLOO Low Power Flash FPGAs with Flash*Freeze Technology
• Manufacturer: MICROSEMI [Microsemi Corporation]

Package Pin Assignments
QN132
Notes:
1. This is the bottom view of the package.
2. The die attach paddle center of the package is tied to ground (GND).
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
http://www.microsemi.com/soc/products/solutions/package/docs.aspx.
4- 30
A36
A25
D4
D3
B23
B33
C30
C21
A37
A24
B34
B22
C31
C20
R ev i sio n 1 9
C40
C11
B44
B12
A48
A13
Pin A1Mark
C1
C10
B11
B1
Optional
Corner Pad (4x)
D1
D2
A1
A12