MT41J64M16LA-187E:B TR Micron Technology Inc, MT41J64M16LA-187E:B TR Datasheet - Page 4
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MT41J64M16LA-187E:B TR
Manufacturer Part Number
MT41J64M16LA-187E:B TR
Description
IC DDR3 SDRAM 1GBIT 96FBGA
Manufacturer
Micron Technology Inc
Type
DDR3 SDRAMr
Specifications of MT41J64M16LA-187E:B TR
Format - Memory
RAM
Memory Type
DDR3 SDRAM
Memory Size
1G (64M x 16)
Speed
533MHz
Interface
Parallel
Voltage - Supply
1.425 V ~ 1.575 V
Operating Temperature
0°C ~ 95°C
Package / Case
96-FBGA
Organization
64Mx16
Density
1Gb
Address Bus
16b
Maximum Clock Rate
1.066GHz
Operating Supply Voltage (typ)
1.5V
Package Type
FBGA
Operating Temp Range
0C to 95C
Operating Supply Voltage (max)
1.575V
Operating Supply Voltage (min)
1.425V
Supply Current
265mA
Pin Count
96
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
557-1378-2
Input Clock Frequency Change ...................................................................................................................... 121
Write Leveling ............................................................................................................................................... 123
Initialization ................................................................................................................................................. 128
Mode Registers .............................................................................................................................................. 130
Mode Register 0 (MR0) .................................................................................................................................. 131
Mode Register 1 (MR1) .................................................................................................................................. 135
Mode Register 2 (MR2) .................................................................................................................................. 138
Mode Register 3 (MR3) .................................................................................................................................. 141
MODE REGISTER SET (MRS) Command ........................................................................................................ 149
ZQ CALIBRATION Operation ......................................................................................................................... 150
ACTIVATE Operation ..................................................................................................................................... 151
READ Operation ............................................................................................................................................ 153
WRITE Operation .......................................................................................................................................... 164
PRECHARGE Operation ................................................................................................................................. 174
SELF REFRESH Operation ............................................................................................................................. 174
Extended Temperature Usage ........................................................................................................................ 176
Power-Down Mode ....................................................................................................................................... 177
RESET Operation ........................................................................................................................................... 185
On-Die Termination (ODT) ........................................................................................................................... 187
Dynamic ODT ............................................................................................................................................... 189
Synchronous ODT Mode ............................................................................................................................... 194
PDF: 09005aef826aa906
1Gb_DDR3_SDRAM.pdf – Rev. J 05/10 EN
DLL Disable Mode ..................................................................................................................................... 117
Write Leveling Procedure ........................................................................................................................... 125
Write Leveling Mode Exit Procedure ........................................................................................................... 127
Burst Length ............................................................................................................................................. 131
Burst Type ................................................................................................................................................ 132
DLL RESET ................................................................................................................................................ 133
Write Recovery .......................................................................................................................................... 133
Precharge Power-Down (Precharge PD) ..................................................................................................... 134
CAS Latency (CL) ....................................................................................................................................... 134
DLL Enable/DLL Disable ........................................................................................................................... 135
Output Drive Strength ............................................................................................................................... 136
OUTPUT ENABLE/DISABLE ...................................................................................................................... 136
TDQS Enable ............................................................................................................................................. 136
On-Die Termination .................................................................................................................................. 137
WRITE LEVELING ..................................................................................................................................... 137
POSTED CAS ADDITIVE Latency ................................................................................................................ 137
CAS Write Latency (CWL) ........................................................................................................................... 139
AUTO SELF REFRESH (ASR) ...................................................................................................................... 139
SELF REFRESH TEMPERATURE (SRT) ....................................................................................................... 140
SRT vs. ASR ............................................................................................................................................... 140
DYNAMIC ODT ......................................................................................................................................... 140
MULTIPURPOSE REGISTER (MPR) ............................................................................................................ 141
MPR Functional Description ...................................................................................................................... 142
MPR Register Address Definitions and Bursting Order ................................................................................ 143
MPR Read Predefined Pattern .................................................................................................................... 149
DQ Input Timing ....................................................................................................................................... 172
Functional Representation of ODT ............................................................................................................. 187
Nominal ODT ........................................................................................................................................... 187
Functional Description .............................................................................................................................. 189
ODT Latency and Posted ODT ................................................................................................................... 194
Timing Parameters .................................................................................................................................... 194
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
1Gb: x4, x8, x16 DDR3 SDRAM
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