C8051F530-TB Silicon Laboratories Inc, C8051F530-TB Datasheet - Page 44

• Manufacturer Part Number: C8051F530-TB
• Description: BOARD PROTOTYPE W/C8051F530
• Manufacturer: Silicon Laboratories Inc
• Type: MCUr

Specifications of C8051F530-TB

• Contents: Board
• Processor To Be Evaluated: C8051F52xA and C8051F53xA
• Interface Type: USB
• Lead Free Status / RoHS Status: Vendor undefined / Vendor undefined
• For Use With/related Products: C8051F530
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

C8051F52x/F52xA/F53x/F53xA
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Table 3.6. TSSOP-20 Landing Diagram Dimensions
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This land pattern design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all
7. A No-Clean, Type-3 solder paste is recommended.
8. The recommended card reflow profile is per the JEDEC/IPC J-STD-
between the solder mask and the metal pad is to be 60 µm minimum,
all the way around the pad.
walls should be used to assure good solder paste release.
perimeter pads.
020 specification for Small Body Components.
Symbol
X1
Y1
C
E
Figure 3.4. TSSOP-20 Landing Diagram
Rev. 1.3
5.80
0.35
1.35
Min
0.65 BSC.
Max
5.90
0.45
1.45