STM8S103F3P6

Manufacturer Part NumberSTM8S103F3P6
DescriptionMCU 8BIT 8KB FLASH 20-TSSOP
ManufacturerSTMicroelectronics
SeriesSTM8S
STM8S103F3P6 datasheet
 

Specifications of STM8S103F3P6

Core ProcessorSTM8Core Size8-Bit
Speed16MHzConnectivityI²C, IrDA, LIN, SPI, UART/USART
PeripheralsBrown-out Detect/Reset, POR, PWM, WDTNumber Of I /o16
Program Memory Size8KB (8K x 8)Program Memory TypeFLASH
Eeprom Size640 x 8Ram Size1K x 8
Voltage - Supply (vcc/vdd)2.95 V ~ 5.5 VData ConvertersA/D 5x10b
Oscillator TypeInternalOperating Temperature-40°C ~ 85°C
Package / Case20-TSSOPProcessor SeriesSTM8S10x
CoreSTM8Data Bus Width8 bit
Data Ram Size1 KBInterface TypeI2C, SPI, UART
Maximum Clock Frequency16 MHzNumber Of Programmable I/os16
Number Of Timers7Maximum Operating Temperature+ 85 C
Mounting StyleSMD/SMT3rd Party Development ToolsEWSTM8
Development Tools By SupplierSTM8/128-MCKIT, STM8S-DISCOVERY, ST-LINK, STICE-SYS001, STX-RLINKMinimum Operating Temperature- 40 C
On-chip Adc10 bit, 5 ChannelFeatured ProductSTM32 Cortex-M3 Companion Products
For Use With497-10593 - KIT STARTER FOR STM8S207/8 SERLead Free Status / RoHS StatusLead free / RoHS Compliant
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Thermal characteristics
12
Thermal characteristics
The maximum chip junction temperature (T
Operating
conditions.
The maximum chip-junction temperature, T
the following equation:
T
= T
+ (P
Jmax
Amax
Where:
T
is the maximum ambient temperature in °C
Amax
Θ
is the package junction-to-ambient thermal resistance in °C/W
JA
P
is the sum of P
Dmax
P
is the product of I
INTmax
power.
P
represents the maximum power dissipation on output pins
I/Omax
Where: P
I/Omax
V
/I
of the I/Os at low and high level in the application.
OH
OH
Symbol
Parameter
Θ
Thermal resistance junction-ambient
JA
TSSOP20 - 4.4 mm
Θ
Thermal resistance junction-ambient
JA
SO20W (300 mils)
Θ
Thermal resistance junction-ambient
JA
UFQFPN20 - 3 x 3 mm
Θ
Thermal resistance junction-ambient
JA
LQFP32 - 7 x 7 mm
Θ
Thermal resistance junction-ambient
JA
UFQFPN32 - 5 x 5 mm
(1)
Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural
convection environment.
100/113
) must never exceed the values given in
J max
, in degrees Celsius, may be calculated using
Jmax
x Θ
)
Dmax
JA
and P
(PDmax = P
INTmax
I/Omax
andV
, expressed in Watts. This is the maximum chip internal
DD
DD
=Σ (V
*I
) + Σ((V
-V
)*I
OL
OL
DD
OH
OH
Table 57: Thermal characteristics
(1)
DocID15441 Rev 6
STM8S103K3 STM8S103F3 STM8S103F2
+ P
)
INTmax
I/Omax
), taking into account the actual V
Value
84
91
90
60
38
/I
OL
OL and
Unit
°C/W
°C/W
°C/W
°C/W
°C/W