STM8S103F3P6

Manufacturer Part NumberSTM8S103F3P6
DescriptionMCU 8BIT 8KB FLASH 20-TSSOP
ManufacturerSTMicroelectronics
SeriesSTM8S
STM8S103F3P6 datasheet
 

Specifications of STM8S103F3P6

Core ProcessorSTM8Core Size8-Bit
Speed16MHzConnectivityI²C, IrDA, LIN, SPI, UART/USART
PeripheralsBrown-out Detect/Reset, POR, PWM, WDTNumber Of I /o16
Program Memory Size8KB (8K x 8)Program Memory TypeFLASH
Eeprom Size640 x 8Ram Size1K x 8
Voltage - Supply (vcc/vdd)2.95 V ~ 5.5 VData ConvertersA/D 5x10b
Oscillator TypeInternalOperating Temperature-40°C ~ 85°C
Package / Case20-TSSOPProcessor SeriesSTM8S10x
CoreSTM8Data Bus Width8 bit
Data Ram Size1 KBInterface TypeI2C, SPI, UART
Maximum Clock Frequency16 MHzNumber Of Programmable I/os16
Number Of Timers7Maximum Operating Temperature+ 85 C
Mounting StyleSMD/SMT3rd Party Development ToolsEWSTM8
Development Tools By SupplierSTM8/128-MCKIT, STM8S-DISCOVERY, ST-LINK, STICE-SYS001, STX-RLINKMinimum Operating Temperature- 40 C
On-chip Adc10 bit, 5 ChannelFeatured ProductSTM32 Cortex-M3 Companion Products
For Use With497-10593 - KIT STARTER FOR STM8S207/8 SERLead Free Status / RoHS StatusLead free / RoHS Compliant
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STM8S103K3 STM8S103F3 STM8S103F2
11.2
32-lead UFQFPN package mechanical data
Figure 46: 32-lead, ultra thin, fine pitch quad flat no-lead package (5 x 5)
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint
life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended
to connect and solder this backside pad to PCB ground.
4. Dimensions are in millimeters.
Table 53: 32-lead, ultra thin, fine pitch quad flat no-lead package mechanical data
Dim.
mm
Min
A
0.500
A1
0
A3
inches
Typ
Max
Min
0.550
0.600
0.0197
0.020
0.050
0.200
DocID15441 Rev 6
Package information
AOB8_ME
(1)
Typ
Max
0.0217
0.0236
0.0008
0.0020
0.0079
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