MC908GR16VFAE Freescale Semiconductor, MC908GR16VFAE Datasheet - Page 4

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MC908GR16VFAE

Manufacturer Part Number
MC908GR16VFAE
Description
IC MCU 16K FLASH 8MHZ 48-LQFP
Manufacturer
Freescale Semiconductor
Series
HC08r
Datasheets

Specifications of MC908GR16VFAE

Core Processor
HC08
Core Size
8-Bit
Speed
8MHz
Connectivity
LIN, SCI, SPI
Peripherals
LVD, POR, PWM
Number Of I /o
37
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Package / Case
48-LQFP
Controller Family/series
HC08
No. Of I/o's
37
Ram Memory Size
1KB
Cpu Speed
8MHz
No. Of Timers
2
Embedded Interface Type
SCI, SPI
Rohs Compliant
Yes
Processor Series
HC08GR
Core
HC08
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
SCI, SPI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
33
Number Of Timers
4
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Development Tools By Supplier
FSICEBASE, DEMO908GZ60E, M68CBL05CE, M68EML08GPGTE
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit, 8 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

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Quantity
Price
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Part Number:
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Revision History
Revision History (Continued)
4
September,
January,
March,
April,
Date
2004
2005
2007
2007
Revision
Level
2.0
3.0
4.0
5.o
Figure 1-1. MCU Block Diagram — Removed data bus switch module
Figure 2-2. Control, Status, and Data Registers and Figure 5-1. Configuration
Register 2 (CONFIG2) — Changed name of bit 0 from SCIBDSRC to
ESCIBDSRC
14.8.8 ESCI Prescaler Register — Updated description in this subsection
14.9.1 ESCI Arbiter Control Register — Updated description of ACLK bit
14.9.3 Bit Time Measurement — Updated bit time measurement mode for
ACLK = 0
Added dc injection current values to:
20.9.1 CGM Component Specifications — Corrected series resistor values
20.15 Memory Characteristics — Table updated to reflect new values
10.5 Clock Generator Module (CGM) — Updated description to remove
erroneous information.
20.9 Clock Generation Module Characteristics — Updated to reflect correct
values.
Table 13-2. Interrupt Source Flags — Changed IF7 to TIM2 channel instead
of Reserved.
Table 2-1. Vector Addresses — Changed address $FFEE to TIM2 Channel 1
Vector (High) and $FFEF to TIM2 Channel 1 Vector (Low) from Reserved
Figure 2-2. Control, Status, and Data Registers — Changed addresses
$0033 to $0035 to show TIM2 Channel 1 registers.
Figure 2-2. Control, Status, and Data Registers
TMBCLKSEL to be compatile with development tool nomenclature
Chapter 5 Configuration Register (CONFIG)
CGMXCLK, replaced TMCLKSEL with TMBCLKSEL to be compatible with
development tool nomenclature, and replaced exponents for COP timeout
period
6.2 Functional Description
10.6.2 Stop Mode
Figure 14-2. ESCI Module Block Diagram
CLOCK and removed reference to rx BUSCLK
Figure 14-5. ESCI Transmitter
Diagram
14.8.7 ESCI Baud Rate Register
LINR bits
Figure 17-1 . Timebase Block Diagram
Replaced TBMCLKSEL with TMBCLKSEL to be compatible with
development tool nomenclature
20.5 5.0-Vdc Electrical Characteristics
20.6 3.3-Vdc Electrical Characteristics
— Added CGMXCLK OR to BUS CLOCK designator
MC68HC908GR16 Data Sheet, Rev. 5.0
— Changed COPCLK to CGMXCLK
— Replaced exponents for COP timeout period
and
Description
— Replaced description of the LINT and
Figure 14-6. ESCI Receiver Block
and
— Replaced BUS_CLK with BUS
17.5 TBM Interrupt
— Changed COPCLK to
— Replaced TMCLKSEL with
Rate—
Freescale Semiconductor
Number(s)
Page
and
168
172
173
253
255
258
265
112
260
144
113
149
151
154
169
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22
29
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37
29
32
79
84

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